Functional panel, device, and data processor

ABSTRACT

A novel functional panel, a novel device, or a novel data processor is provided. A structure in which a first plane, a second plane that is opposite the first plane, and a neutral plane between the first plane and the second plane are provided and a portion of a functional layer having a thickness greater than or equal to half of the thickness of the functional layer is in a region between the first plane and the neutral plane was conceived.

BACKGROUND OF THE INVENTION 1. Field of the Invention

One embodiment of the present invention relates to a functional panel, adevice, or a data processor.

Note that one embodiment of the present invention is not limited to theabove technical field. The technical field of one embodiment of theinvention disclosed in this specification and the like relates to anobject, a method, or a manufacturing method. In addition, one embodimentof the present invention relates to a process, a machine, manufacture,or a composition of matter. Specifically, examples of the technicalfield of one embodiment of the present invention disclosed in thisspecification include a semiconductor device, a display device, alight-emitting device, a power storage device, a memory device, a methodfor driving any of them, and a method for manufacturing any of them.

2. Description of the Related Art

The social infrastructures relating to means for transmittinginformation have advanced. This has made it possible to acquire,process, and send out many pieces and various kinds of information withthe use of a data processor not only at home or office but also at othervisiting places.

With this being the situation, portable data processors are under activedevelopment.

For example, portable data processors are often used while being carriedaround by a user, and force might be accidentally applied, by dropping,to the data processors and display devices included in them. As anexample of a display device that is not easily broken, a display devicehaving high adhesiveness between a structure body by which alight-emitting layer is divided and a second electrode layer is known(Patent Document 1).

REFERENCE Patent Document

-   [Patent Document 1] Japanese Published Patent Application No.    2012-190794

SUMMARY OF THE INVENTION

An object of one embodiment of the present invention is to provide anovel functional panel that is highly convenient or reliable. Anotherobject of one embodiment of the present invention is to provide a noveldevice that is highly convenient or reliable. Another object of oneembodiment of the present invention is to provide a novel functionalpanel, a novel device, or a novel semiconductor device.

Note that the descriptions of these objects do not preclude theexistence of other objects. In one embodiment of the present invention,there is no need to achieve all the objects. Other objects will beapparent from and can be derived from the description of thespecification, the drawings, the claims, and the like.

One embodiment of the present invention is a functional panel includinga first plane, a second plane that is opposite the first plane, aneutral plane in a region between the first plane and the second plane,a functional layer at least a portion of which is in a region betweenthe first plane and the neutral plane, and a support capable ofsupporting the functional layer. The portion of the functional layer hasa thickness greater than or equal to half of the thickness of thefunctional layer.

In the functional panel of one embodiment of the present inventiondescribed above, the portion of the functional layer having a thicknessgreater than or equal to half of the thickness of the functional layeris positioned in the region between the first plane and the neutralplane. With this structure, the functional panel can be bent with thefirst plane inside such that compressive stress is applied to theportion of the functional layer. Thus, a novel functional panel can beprovided.

Another embodiment of the present invention is the above functionalpanel further including a first region that overlaps with the portion ofthe functional layer and a second region that is adjacent to the firstregion. The support includes a first member in a region between thesecond plane in the first region and the functional layer and a secondmember in a region between the second plane in the second region and thefunctional layer. The first member has a higher rigidity than the secondmember.

The functional panel of one embodiment of the present inventiondescribed above includes the first region where the portion of thefunctional layer having a thickness greater than or equal to half of thethickness of the functional layer is positioned in the region betweenthe first plane and the neutral plane, and the second region adjacent tothe first region. The support includes the second member that ispositioned between the second plane in the second region and thefunctional layer and the first member that has a higher rigidity thanthe second member and is positioned between the second plane in thefirst region and the functional layer. With this structure, thefunctional panel can be bent with the first plane inside such thatcompressive stress is applied to the portion of the functional layer inthe first region. Thus, a novel functional panel can be provided.

Another embodiment of the present invention is a functional panelincluding a first plane, a second plane that is opposite the firstplane, a middle plane in a middle of a region between the first planeand the second plane, a functional layer at least a portion of which isin a region between the first plane and the middle plane, and a supportcapable of supporting the functional layer. The portion of thefunctional layer has a thickness greater than or equal to half of thethickness of the functional layer. A portion of the functional panel inthe region between the first plane and the middle plane has a rigidityapproximately equal to that of a portion of the functional panel in aregion between the second plane and the middle plane.

In the functional panel of one embodiment of the present inventiondescribed above, the portion of the functional layer having a thicknessgreater than or equal to half of the thickness of the functional layeris positioned in the region between the first plane and the middleplane. With this structure, the functional panel can be bent with thefirst plane inside such that compressive stress is applied to theportion of the functional layer. Thus, a novel functional panel can beprovided.

Another embodiment of the present invention is the above functionalpanel further including a first region that overlaps with the portion ofthe functional layer and a second region that is adjacent to the firstregion. The support includes a first member in a region between thesecond plane in the first region and the functional layer and a secondmember in a region between the second plane in the second region and thefunctional layer. The first member is thicker than the second member.

The functional panel of one embodiment of the present inventiondescribed above includes the first region where the portion of thefunctional layer having a thickness greater than or equal to half of thethickness of the functional layer is positioned in the region betweenthe first plane and the middle plane, and the second region adjacent tothe first region. The support includes the second member that ispositioned between the second plane in the second region and thefunctional layer and the first member that is thicker than the secondmember and is positioned between the second plane in the first regionand the functional layer. With this structure, the functional panel canbe bent with the first plane inside such that compressive stress isapplied to the portion of the functional layer in the first region.Thus, a novel functional panel can be provided.

Another embodiment of the present invention is a functional paneldescribed above in which the functional layer includes a displayelement.

Another embodiment of the present invention is a functional paneldescribed above in which the functional layer includes a sensor element.

Another embodiment of the present invention is a device including theabove functional panel and a frame capable of supporting the functionalpanel. The frame is capable of putting the functional panel into a bentstate with the first plane inside.

Another embodiment of the present invention is a device including theabove functional panel and a frame capable of supporting the functionalpanel. The frame is capable of putting the functional panel into a bentstate with the first plane inside in such a manner that a fold having acurvature radius greater than or equal to a first curvature radius isformed. In addition, the frame is capable of putting the functionalpanel into a bent state with the second plane inside in such a mannerthat a fold having a curvature radius greater than the first curvatureradius is formed.

The device of one embodiment of the present invention described aboveincludes the functional panel and the frame capable of putting thefunctional panel into a bent state with the first plane inside. Withthis structure, the functional panel can be bent with the first planeinside. Thus, a novel device can be provided.

Another embodiment of the present invention is a device including theabove functional panel and a frame capable of supporting the functionalpanel. The frame is capable of putting the functional panel into a bentstate with the first plane inside in such a manner that a fold is formedin the first region.

Another embodiment of the present invention is a device including theabove functional panel and a frame capable of supporting the functionalpanel. The frame is capable of putting the functional panel into a bentstate with the first plane inside in such a manner that a fold having acurvature radius greater than or equal to a first curvature radius isformed in the first region. In addition, the frame is capable of puttingthe functional panel into a bent state with the second plane inside insuch a manner that a fold having a curvature radius greater than thefirst curvature radius is formed in the first region.

The device of one embodiment of the present invention described aboveincludes the functional panel and the frame capable of putting thefunctional panel into a bent state with the first plane inside in such amanner that a fold is formed in the first region. With this structure,the functional panel can be bent with the first plane inside in such amanner that a fold is formed in the first region. Thus, a novel devicecan be provided.

Another embodiment of the present invention is a data processorincluding the above device and at least one of a microphone, an antenna,a battery, an operation switch, and a housing.

The data processor of one embodiment of the present invention describedabove includes the functional panel and the frame capable of putting thefunctional panel into a bent state with the first plane inside. Withthis structure, the functional panel can be put into a folded state oran unfolded state. Thus, a novel data processor can be provided.

In this specification, a device includes the following in its category:a module to which a connector such as a flexible printed circuit (FPC)or a tape carrier package (TCP) is attached; a module having a TCPprovided with a printed wiring board at the end thereof; and a substrateover which an integrated circuit (IC) is mounted by a chip on glass(COG) method and a light-emitting element is formed.

One embodiment of the present invention can provide a novel functionalpanel that is highly convenient or reliable. Another embodiment of thepresent invention can provide a novel device that is highly convenientor reliable. Another embodiment of the present invention can provide anovel data processor that is highly convenient or reliable. Anotherembodiment of the present invention can provide a novel functionalpanel, a novel device, a novel data processor, or a novel semiconductordevice.

Note that the description of these effects does not preclude theexistence of other effects. One embodiment of the present invention doesnot necessarily achieve all the effects listed above. Other effects willbe apparent from and can be derived from the description of thespecification, the drawings, the claims, and the like.

BRIEF DESCRIPTION OF THE DRAWINGS

In the accompanying drawings:

FIGS. 1A to 1D each illustrate a functional panel of one embodiment;

FIGS. 2A and 2B each illustrate a functional panel of one embodiment;

FIGS. 3A and 3B each illustrate a functional panel of one embodiment;

FIGS. 4A and 4B each illustrate a functional panel of one embodiment;

FIGS. 5A to 5D each illustrate a device of one embodiment;

FIGS. 6A to 6D each illustrate a device of one embodiment;

FIGS. 7A to 7C each illustrate a device of one embodiment;

FIGS. 8A to 8D each illustrate a device of one embodiment;

FIGS. 9A-1, 9A-2, 9B-1, 9B-2, 9C, 9D-1, 9D-2, 9E-1, and 9E-2 areschematic views illustrating a manufacturing process of a stack of oneembodiment;

FIGS. 10A-1, 10A-2, 10B-1, 10B-2, 10C, 10D-1, 10D-2, 10E-1; and 10E-2are schematic views illustrating a manufacturing process of a stack ofone embodiment;

FIGS. 11A-1, 11A-2, 11B, 11C, 11D-1, 11D-2, 11E-1, and 11E-2 areschematic views illustrating a manufacturing process of a stack of oneembodiment;

FIGS. 12A-1, 12A-2, 12B-1, 12B-2, 12C-1, 12C-2, 12D-1, and 12D-2 areschematic views illustrating manufacturing processes of stacks, eachhaving an opening portion in a support, of embodiments;

FIGS. 13A-1, 13A-2, 13B-1, and 13B-2 are schematic views illustratingstructures of processed members of embodiments;

FIG. 14 illustrates an input/output device of one embodiment;

FIGS. 15A to 15C each illustrate an input/output device of oneembodiment;

FIGS. 16A-1, 16A-2, 16A-3, 16B-1; 16B-2, 16C-1, and 16C-2 are projectionviews illustrating structures of data processors of embodiments;

FIGS. 17A to 17D illustrate structures of a device and functional panelsof examples;

FIGS. 18A to 18D illustrates structures of a sensor panel of oneembodiment;

FIGS. 19A to 19D each illustrate a structure of an electrode of a sensorpanel of one embodiment;

FIGS. 20A to 20C each illustrate structures of electrodes of a sensorpanel of one embodiment;

FIGS. 21A to 21F each illustrate structures of electrodes of a sensorpanel of one embodiment;

FIGS. 22A and 22B each illustrate a structure of a display panel of oneembodiment;

FIGS. 23A and 23B each illustrate a structure of a display panel of oneembodiment;

FIG. 24 illustrates an input/output device of one embodiment;

FIG. 25 illustrates an input/output device of one embodiment;

FIG. 26 illustrates an input/output device of one embodiment; and

FIG. 27 illustrates an input/output device of one embodiment.

DETAILED DESCRIPTION OF THE INVENTION

A functional panel of one embodiment of the present invention includes afirst plane, a second plane that is opposite the first plane, and aneutral plane between the first plane and the second plane. A portion ofa functional layer having a thickness greater than or equal to thethickness of the functional layer is in a region between the first planeand the neutral plane.

With this structure, the functional panel can be bent with the firstplane inside such that compressive stress is applied to the portion ofthe functional layer. Thus, a novel functional panel, a novel device, ora novel data processor can be provided.

Note that the terms “film” and “layer” can be interchanged with eachother according to the case or circumstances. For example, the term“conductive layer” can be changed into the term “conductive film” insome cases. Also, the term “insulating film” can be changed into theterm “insulating layer” in some cases.

Embodiments will be described in detail with reference to the drawings.However, the present invention is not limited to the description below,and it is easily understood by those skilled in the art that variouschanges and modifications can be made without departing from the spiritand scope of the present invention. The present invention thereforeshould not be interpreted as being limited to the content of theembodiments below. Note that in the structures of the inventiondescribed below, the same portions or portions having similar functionsare denoted by the same reference numerals in different drawings, anddescription of such portions is not repeated.

Embodiment 1

In this embodiment, the structure of a functional panel of oneembodiment of the present invention will be described with reference toFIGS. 1A to 1D, FIGS. 2A and 2B, FIGS. 3A and 3B, and FIGS. 4A and 4B.

FIGS. 1A to 1D illustrate the structures of functional panels ofembodiments of the present invention. FIG. 1A is a top view of afunctional panel 100A of one embodiment of the present invention, andFIG. 1B is a cross-sectional view taken along the line X1-X2 in FIG. 1A.

FIG. 1C is a top view of a functional panel 100A2 of one embodiment ofthe present invention, and FIG. 1D is a cross-sectional view taken alongthe line X3-X4 in FIG. 1C.

Structural Example 1 of Functional Panel

The functional panel 100A described in this embodiment includes a firstplane 1, a second plane 2 that is opposite the first plane 1, a neutralplane 5A in a region between the first plane 1 and the second plane 2, afunctional layer 3 at least a portion 3A of which is in a region betweenthe first plane 1 and the neutral plane 5A, and a support (a member 4Aand a member 4B) that supports the functional layer 3 (see FIGS. 1A and1B). The thickness of the portion 3A of the functional layer 3 isgreater than or equal to half of the thickness d of the functional layer3.

In the functional panel 100A described in this embodiment, the portion3A of the functional layer 3, which has the thickness greater than orequal to half of the thickness d of the functional layer 3, ispositioned in the region between the first plane 1 and the neutral plane5A.

With this structure, the functional panel 100A can be bent with thefirst plane 1 inside such that compressive stress is applied to theportion 3A of the functional layer 3. Thus, a novel functional panel canbe provided.

The functional layer 3 can be provided with a display element 9A (seeFIG. 1A).

The functional layer 3 can be provided with a sensor element 9B.

The functional panel 100A can have an opening portion. For example, thefunctional panel 100A can have an opening portion that has a regionoverlapping with a terminal T provided over the functional layer 3.

A modification example of the functional panel is shown in FIGS. 1C and1D. A functional panel 100A2 shown in FIGS. 1C and 1D is different fromthe functional panel 100A described with reference to FIGS. 1A and 1B inthat one side of a functional layer 3 is exposed on a first plane 1, andthe other side of the functional layer 3 is in contact with one side ofa support 4.

Individual components included in the functional panel 100A will bedescribed below. Note that these components cannot be clearlydistinguished and one component also serves as another component orinclude part of another component in some cases.

<<Structure of Functional Panel>>

The functional panel 100A described in this embodiment includes thefirst plane 1, the second plane 2, the neutral plane 5A, the functionallayer 3, or the support (the member 4A or the member 4B).

<<First Plane, Second Plane, and Neutral Plane>>

The functional panel 100A can have a variety of outside shapes. Forexample, the functional panel 100A can have a plate-like shape or asheet-like shape.

The first plane 1 or the second plane 2 is included in a surface of thefunctional panel 100A, and the first plane 1 or the second plane 2 canhave a variety of shapes. For example, the first plane 1 can be square,polygonal, or circular.

The first plane 1 or the second plane 2 may include a portion of asurface of the support or a portion of a surface of the functional layer3.

The neutral plane 5A is a plane that hardly expands or contracts whenthe functional panel 100A is bent with the first plane 1 inside.Specifically, a change in size of the neutral plane 5A caused when thefunctional panel 100A is bent with the first plane 1 inside is −15 ppmto +15 ppm inclusive, preferably −10 ppm to +10 ppm inclusive.

Note that using a variety of different structures for the functionalpanel 100A can change the position of the neutral plane 5A.

For example, when a member that is less rigid than a member used in aregion between the second plane 2 and the neutral plane 5A (e.g., themember 4B) is used in a region between the first plane 1 and the neutralplane 5A (e.g., the member 4A), the neural plane 5A can be closer to thesecond plane 2.

For example, when a member that is thinner than a member used in aregion between the second plane 2 and the functional layer 3 is used ina region between the first plane 1 and the functional layer 3, theneutral plane 5A can be closer to the second plane 2.

<<Support>>

A single member or a plurality of members can be used as the support.For example, the member 4A and the member 4B can be used as the support.Specifically, the plate-like, sheet-like, or film-like members 4A and 4Bcan be attached to each other to be used as the support.

An inorganic material, an organic material, or a composite material ofan inorganic material and an organic material, for example, can be usedfor the support.

The support has heat resistance high enough to withstand a manufacturingprocess and the thickness and size that are appropriate formanufacturing apparatus.

An organic material such as a resin, a resin film, or plastic, forexample, can be used for the member 4A or the member 4B. Specifically, athin film or plate containing polyester, polyolefin, polyamide,polyimide, polycarbonate, or an acrylic resin can be used.

An inorganic material such as glass, ceramic, or metal, for example, canbe used for the member 4A or the member 4B. Specifically, a platecontaining non-alkali glass, soda-lime glass, potash glass, crystalglass, or the like can be used. Specifically, a metal foil or metalplate containing stainless steel (SUS), aluminum, magnesium, or the likecan be used.

An inorganic oxide, an inorganic nitride, or an inorganic oxynitride,for example, can be used for the member 4A or the member 4B.Specifically, a thin film containing silicon oxide, silicon nitride,silicon oxynitride, alumina, or the like can be used.

A single material or a composite material of a plurality of materials,for example, can be used for the member 4A or the member 4B.Specifically, it is possible to use a composite material in which aplurality of materials are stacked or a composite material in which afibrous or particulate material is dispersed in another material. Forexample, a composite material including an insulating layer, a resinfilm, and a resin layer attaching the insulating layer to the resin filmcan be used for the member 4A.

A material in which a base and an insulating layer that prevents thediffusion of impurities contained in the base are stacked, for example,can be used for the member 4A or the member 4B. Specifically, it ispossible to use a material in which glass and one or more of materialsthat prevent the diffusion of impurities contained in the glass, e.g.,silicon oxide, silicon nitride, or silicon oxynitride, are stacked. Itis also possible to use a material in which a resin and one or more ofmaterials that prevent the diffusion of impurities passing through theresin, such as silicon oxide, silicon nitride, and silicon oxynitride,are stacked.

A composite material such as a resin film or the like to which a metalplate, a thin glass plate, or a film of an inorganic material isattached, for example, can be used for the member 4A or the member 4B.

If a composite material in which an inorganic film with a thickness ofseveral μm or less and a resin film with a thickness of ten and severalto several hundred micrometers are attached is used, the compositematerial that can be bent with a curvature radius of 5 mm or more,preferably 4 mm or more, more preferably 3 mm or more, and particularlypreferably 1 mm or more can be used for the member 4A or the member 4B.

<<Functional Layer>>

A functional circuit, a functional element, an optical element, afunctional film, or a layer including a plurality of elements selectedfrom these, for example, can be used as the functional layer 3.

A layer including a single functional element or a plurality ofdifferent functional elements can be used as the functional layer 3. Forexample, a layer in which a plurality of functional elements arearranged in a matrix can be used.

An electric element or a biochip, for example, can be used as thefunctional element. Specifically, a transistor, a capacitor, a resistor,a memory element, a light-emitting element, a display element, or thelike can be used.

A functional element and a functional circuit for driving the functionalelement, for example, can be included in the functional layer 3.

A film that suppresses the diffusion of impurities, for example, can beincluded in the functional layer 3.

An optical element such as a coloring layer or a light-blocking layer,for example, can be included in the functional layer 3.

<<Display Element>>

The display element 9A, a pixel circuit for driving the display element9A, or a driver circuit for driving the pixel circuit, for example, canbe included in the functional layer 3. Further, a color filter that hasa region overlapping with the display element 9A or a layer thatprevents the diffusion of impurities into the display element can beincluded in the functional layer 3 (see FIG. 1A).

A light-emitting element, for example, can be used as the displayelement 9A. Specifically, an organic electroluminescent element can beused as the display element 9A.

With such a structure, a functional panel that can be used as a displaypanel can be provided.

<<Sensor Element>>

The sensor element 9B, for example, can be included in the functionallayer 3. Specifically, a proximity sensor can be used as the sensorelement 9B. A capacitor, for example, can be used as the sensor element9B (see FIG. 1A).

With such a structure, a functional panel that can be used as a touchpanel can be provided.

Structure Example 2 of Functional Panel

Another structure of a functional panel of one embodiment of the presentinvention will be described with reference to FIGS. 2A and 2B.

FIGS. 2A and 2B illustrate the structure of a functional panel of oneembodiment of the present invention. FIG. 2A is a top view of afunctional panel 100B of one embodiment of the present invention, andFIG. 2B is a cross-sectional view taken along the line X5-X6 in FIG. 2A.

The functional panel 100B described in this embodiment includes a firstregion 7A that overlaps with a portion 3A of a functional layer 3 and asecond region 7B adjacent to the first region 7A (see FIGS. 2A and 2B).A support includes a first member 4C in a region between a second plane2 in the first region 7A and the functional layer 3 and a second member4D in a region between the second plane 2 in the second region 7B andthe functional layer 3. The first member 4C has a higher rigidity thanthe second member 4D.

The functional panel 100B described in this embodiment includes thefirst region 7A where the portion 3A of the functional layer 3 having athickness greater than or equal to half of the thickness of thefunctional layer 3 is positioned in a region between the first plane 1and a neutral plane 5B, and the second region 7B adjacent to the firstregion 7A. The support includes the second member 4D positioned betweenthe second plane 2 in the second region 7B and the functional layer 3and the first member 4C positioned between the second plane 2 in thefirst region 7A and the functional layer 3. The first member 4C has ahigher rigidity than the second member 4D. With this structure, thefunctional panel 100B can be bent with the first plane inside such thatcompressive stress is applied to the portion 3A of the functional layer3 in the first region. Thus, a novel functional panel can be provided.

The functional panel 100B is different from the functional panel 100Adescribed with reference to FIGS. 1A and 1B in that the support includesthe second member 4D and the first member 4C having a higher rigiditythan the second member 4D. Different structures will be described indetail below, and the above description is referred to for the othersimilar structures.

<<Support>>

A single member or a plurality of members can be used as the support.For example, a member 4A, the first member 4C, and the second member 4Dcan be used as the support.

A member having a shape that follows a portion to be bent (e.g., abelt-like shape) and a rigidity higher than that of the second member 4Dis used as the first member 4C. Specifically, a member having a rigidity3% or more higher, preferably 5% or more higher, than that of the secondmember 4D is used as the first member 4C. With this structure, thedistance between the neutral plane 5B and the second plane 2 can beshorter in the first region 7A than in the second region 7B.

Materials that satisfy the above conditions may be selected, from thematerials that can be used for the functional panel 100A, to be used forthe functional panel 100B, for example.

Specifically, it is possible to use a resin film as the second member 4Dand a metal plate with a rigidity 3% or more higher, preferably 5% ormore higher, than that of the second member 4D as the first member 4C.

Note that it is also possible to employ a structure in which a memberthat is less rigid than the member 4A is positioned between the neutralplane 5B in the first region 7A and the first plane 1.

Structural Example 3 of Functional Panel

Another structure of a functional panel of one embodiment of the presentinvention will be described with reference to FIGS. 3A and 3B.

FIGS. 3A and 3B illustrate a structure of a functional panel 100C of oneembodiment of the present invention. FIG. 3A is a top view of thefunctional panel 100C of one embodiment of the present invention, andFIG. 3B is a cross-sectional view taken along the line X7-X8 in FIG. 3A.

The functional panel 100C described in this embodiment includes a firstplane 1, a second plane 2 that is opposite the first plane 1, a middleplane 5C located in the middle of a region between the first plane 1 andthe second plane 2, a functional layer 3 at least a portion 3A of whichis in a region between the first plane 1 and the middle plane 5C, and asupport (a member 4A, a member 4B, and a member 4E) that supports thefunctional layer 3 (see FIGS. 3A and 3B). The thickness of the portion3A is greater than or equal to half of the thickness d of the functionallayer 3. A portion of the functional panel 100C in the region betweenthe first plane 1 and the middle plane 5C has a rigidity approximatelyequal to that of a portion of the functional panel 100C in a regionbetween the second plane 2 and the middle plane 5C. Note that theportion of the functional panel 100C in the region between the firstplane 1 and the middle plane 5C includes the whole of the member 4A, theportion 3A of the functional layer 3, and a portion of the member 4E,and the portion of the functional panel 100C in the region between thesecond plane 2 and the middle plane 5C includes the whole of the member4B and a portion of the member 4E.

Note that in the case where the flexural rigidity of one support isgreater than or equal to 85% and less than or equal to 115%, preferablygreater than or equal to 90% and less than or equal to 110%, of theflexural rigidity of the other support, this specification describes itas the rigidity of the one support being approximately equal to therigidity of the other support. In addition, N·m² can be used as a unitfor flexural rigidity.

In the functional panel 100C described in this embodiment, the portion3A of the functional layer 3, which has a thickness greater than orequal to half of the thickness d of the functional layer 3, ispositioned in the region between the first plane 1 and the middle plane5C. With this structure, the functional panel 100C can be bent with thefirst plane 1 inside such that compressive stress is applied to theportion 3A of the functional layer 3. Thus, a novel functional panel canbe provided.

The functional layer 3 can be provided with a display element 9A (seeFIG. 3A).

The functional layer 3 can be provided with a sensor element 9B.

The functional panel 100C can have an opening portion. For example, thefunctional panel 100C can have an opening portion that has a regionoverlapping with a terminal T provided over the functional layer 3.

The functional panel 100C is different from the functional panel 100Adescribed with reference to FIGS. 1A and 1B in that the portion in theregion between the first plane 1 and the middle plane 5C has a rigidityapproximately equal to that of the portion in the region between thesecond plane 2 and the middle plane 5C. Different structures will bedescribed in detail below, and the above description is referred to forthe other similar structures.

<<Structure of Functional Panel>>

The functional panel 100C described in this embodiment includes thefirst plane 1, the second plane 2, the middle plane 5C, the functionallayer 3, or the support (the member 4A, the member 4B, and the member4E).

<<First Plane, Second Plane, and Middle Plane>>

The functional panel 100C can have a variety of outside shapes. Forexample, the functional panel 100C can have a plate-like shape or asheet-like shape.

The first plane 1 or the second plane 2 is included in a surface of thefunctional panel 100C, and the first plane 1 or the second plane 2 canhave a variety of shapes. For example, the first plane 1 can be square,polygonal, or circular.

The first plane 1 or the second plane 2 may include a portion of asurface of the support or a portion of a surface of the functional layer3.

The middle plane 5C lies midway between the first plane 1 and the secondplane 2 that is opposite the first plane 1.

<<Support>>

The support supports the functional layer 3. A plurality of members canbe used as the support. For example, the member 4A, the member 4B havinga rigidity and a thickness approximately equal to those of the member4A, and the member 4E that attaches the member 4A to the member 4B canbe used as the support. With this structure, the rigidity of the regionbetween the first plane 1 and the middle plane 5C and the rigidity ofthe region between the second plane 2 and the middle plane 5C can beapproximately equal.

Materials that satisfy the above conditions may be selected, from thematerials that can be used for the functional panel 100A, to be used forthe functional panel 100C, for example.

Specifically, it is possible to use a resin film as the member 4A, aresin film having a rigidity and a thickness approximately equal tothose of the member 4A as the member 4B, and an adhesive layer to attachthe member 4A to the member 4B as the member 4E.

Structural Example 4 of Functional Panel

Another structure of a functional panel of one embodiment of the presentinvention will be described with reference to FIGS. 4A and 4B.

FIGS. 4A and 4B illustrate the structure of a functional panel of oneembodiment of the present invention. FIG. 4A is a top view of afunctional panel 100D of one embodiment of the present invention, andFIG. 4B is a cross-sectional view taken along the line X9-X10 in FIG.4A.

The functional panel 100D described in this embodiment includes a firstregion 7A that overlaps with a portion 3A of a functional layer 3 and asecond region 7B adjacent to the first region 7A. A support includes afirst member 4C in a region between a second plane 2 in the first region7A and the functional layer 3 and a second member 4D in a region betweenthe second plane 2 in the second region 7B and the functional layer 3.The first member 4C is thicker than the second member 4D.

The functional panel 100D described in this embodiment includes thefirst region 7A in which the portion 3A of the functional layer 3 havinga thickness greater than or equal to half of the thickness d of thefunctional layer 3 is positioned in a region between a first plane 1 anda middle plane 5D, and the second region 7B adjacent to the first region7A. The support includes the second member 4D that is positioned betweenthe second plane 2 in the second region 7B and the functional layer 3and the first member 4C that is thicker than the second member 4D and ispositioned between the second plane 2 in the first region 7A and thefunctional layer 3. With this structure, the functional panel 100D canbe bent with the first plane inside such that compressive stress isapplied to the portion 3A of the functional layer 3 in the first region.Thus, a novel functional panel can be provided.

The functional panel 100D is different from the functional panel 100Bdescribed with reference to FIGS. 2A and 2B in that the support includesthe second member 4D and the first member 4C that is thicker than thesecond member 4D. Different structures will be described in detailbelow, and the above description is referred to for the other similarstructures.

<<Support>>

A single member or a plurality of members can be used as the support.For example, a member 4A, the member 4D, and the member 4C that makesthe thickness of the first region 7A greater than that of the secondregion 7B can be used as the support.

A member having a shape that follows a portion to be bent (e.g., abelt-like shape) is used as the first member 4C. With this structure,the distance between the middle plane 5D and the second plane 2 can belonger in the first region 7A than in the second region 7B.

Materials that satisfy the above conditions may be selected, from thematerials that can be used for the functional panel 100A, to be used forthe functional panel 100D, for example.

Specifically, it is possible to use a resin film as the member 4A,another resin film as the member 4D, and a material processed into abelt-like shape as the member 4C. A belt-like resin film, a belt-likeresin coating, or a metal plate can be used as the member 4C, forexample.

This embodiment can be combined with any of the other embodiments inthis specification as appropriate.

Embodiment 2

In this embodiment, the structure of a device of one embodiment of thepresent invention will be described with reference to FIGS. 5A to 5D,FIGS. 6A to 6D, FIGS. 7A to 7C, and FIGS. 8A to 8D.

FIGS. 5A to 5D illustrate the structure of a device of one embodiment ofthe present invention. FIG. 5A is a projection view illustrating adevice 200A of one embodiment of the present invention which is bent,and FIG. 5B is a cross-sectional view taken along the line Y1-Y2 in FIG.5A. FIG. 5C is a projection view illustrating the device 200A of oneembodiment of the present invention which is unbent, and FIG. 5D is across-sectional view taken along the line Y3-Y4 in FIG. 5C.

FIGS. 6A to 6D illustrate a hinge portion that can be used in the deviceof one embodiment of the present invention. FIG. 6A is a side viewillustrating the structure of a hinge portion 213 in a bent state, andFIG. 6B is a side view illustrating the structure of the hinge portion213 in an unbent state.

Structural Example 1 of Device

The device 200A described in this embodiment includes the functionalpanel 100A described in Embodiment 1 and a frame 210A that supports thefunctional panel 100A. The frame 210A has a function of putting thefunctional panel 100A into a state in which the functional panel 100A isbent with the first plane 1 inside (see FIGS. 5A and 5B).

The device 200A described as an example in this embodiment includes thefunctional panel 100A described in Embodiment 1 and the frame 210Ahaving a function of putting the functional panel 100A into a bent statewith the first plane 1 inside. Thus, the functional panel can be bentwith the first plane inside, and a novel device can be providedaccordingly.

Individual components of the device 200A will be described below. Notethat these components cannot be clearly distinguished and one componentalso serves as another component or include part of another component insome cases.

<<Structure of Device>>

The device 200A described in this embodiment includes the functionalpanel 100A or the frame 210A,

<<Structure of Frame>>

The frame 210A includes the hinge portion 213, a first guide portion 211connected to the hinge portion 213, and a second guide portion 212connected to the hinge portion 213. The hinge portion 213 has a functionof rotatably connecting the second guide portion 212 to the first guideportion 211 (see FIG. 5B).

A variety of structures can be used as the hinge portion 213. Forexample, a structure including a rotation axis 213S and a plurality ofparts 213P connected to each other with the use of the rotation axis213S can be used (see FIG. 6A).

The hinge portion 213 with the plurality of parts 213P connected to eachother in such a manner that the parts 213P spread like a fan can beused, for example. With the hinge portion 213, the second guide portion212 can move rotationally with respect to the first guide portion 211.Specifically, the second guide portion 212 can move rotationally fromthe state shown in FIG. 6B to the state shown in FIG. 6A.

Although the second guide portion 212 can move rotationally with respectto the first guide portion 211 from the state shown in FIG. 5B to thestate shown in FIG. 5D, when the part 213P comes in contact with theadjacent part as shown in FIG. 6B, the second guide portion 212 cannotgo further. The hinge portion 213 thus allows the functional panel 100Ato be bent only toward one side.

A structure that is less likely to be bent than the hinge portion 213can be used as the first guide portion 211. For example, a box-likestructure, a plate-like structure, or a sheet-like structure with athickness of greater than or equal to 0.2 mm, preferably greater than orequal to 1 mm, can be used as the first guide portion 211. A structuresimilar to the first guide portion 211 can be used as the second guideportion 212.

In addition, an adhesive layer that attaches the functional panel 100Ato the first guide portion 211 can be provided on the side of the firstguide portion 211 that faces the functional panel 100A.

In addition, a structure that allows the functional panel 100A to slidealong the first guide portion 211 as the hinge portion 213 is bent canbe used. For example, the first guide portion 211 having a groove thatholds an edge of the functional panel 100A in a region overlapping withthe edge of the functional panel 100A can be used.

An inorganic material such as metal, glass, or ceramic, an organicmaterial such as resin, or a natural material can be used for the frame210A, for example.

Specifically, engineering plastic or silicone rubber can be used.Stainless steel, aluminum, magnesium alloy, or the like can also be usedfor the frame 210A.

<<Functional Panel>>

The functional panels described in Embodiment 1, for example, can beused. Specifically, the functional panel 100A, the functional panel100A2, the functional panel 100B, the functional panel 100C, thefunctional panel 100D, or the like can be used.

In the case where the functional panel 100B is used, the functionalpanel 100B is positioned such that the first region 7A of the functionalpanel 100B (the region in which the member 4C is positioned) overlapswith the hinge portion 213 of the frame 210A (see FIG. 6C).

In the case where the functional panel 100D is used, the functionalpanel 100D is positioned such that the first region 7A of the functionalpanel 100D (the region in which the member 4C is positioned) overlapswith the hinge portion 213 of the frame 210A (see FIG. 6D).

Structural Example 2 of Device

Another structure of a device of one embodiment of the present inventionwill be described with reference to FIGS. 74 to 7C.

FIGS. 7A to 7C illustrate the structure of a device of one embodiment ofthe present invention. FIG. 7A is a cross-sectional view illustrating adevice 200B of one embodiment of the present invention which is folded.FIG. 7B is a cross-sectional view illustrating the device 200B of oneembodiment of the present invention which is unfolded, and FIG. 7C is across-sectional view illustrating the device 200B of one embodiment ofthe present invention which is bent toward the side opposite to thattoward which the device 200B is folded in FIG. 7A.

The device 200B described in this embodiment includes the functionalpanel 100A described in Embodiment 1 and a frame 210B that supports thefunctional panel 100A. The frame 210B has a function of putting thefunctional panel 100A into a state in which the functional panel 100A isbent with the first plane 1 inside in such a manner that a fold with acurvature radius that is greater than or equal to a first curvatureradius R1 is formed, and a function of putting the functional panel 100Ainto a state in which the functional panel 100A is bent with the secondplane 2 inside in such a manner that a fold with a curvature radius R2that is greater than the first curvature radius R1 is formed (see FIGS.7A to 7C).

The device 200B described as an example in this embodiment includes thefunctional panel 100A described in Embodiment 1 and the frame 210Bhaving a function of putting the functional panel 100A to a bent statewith the first plane 1 inside. Thus, the functional panel can be bentwith the first plane inside, and a novel device can be providedaccordingly.

The device 200B is different from the device 200A described withreference to FIGS. 5A to 5D in that the frame 210B has a function ofputting the functional panel 100A into a state in which the functionalpanel 100A is bent with the first plane 1 inside in such a manner that afold with a curvature radius that is greater than or equal to the firstcurvature radius R1 is formed, and a function of putting the functionalpanel 100A into a state in which the functional panel 100A is bent withthe second plane 2 inside in such a manner that a fold with thecurvature radius R2 that is greater than the first curvature radius R1is formed. Different structures will be described in detail below, andthe above description is referred to for the other similar structures.

<<Structure of Device>>

The device 200B described in this embodiment includes the functionalpanel 100A or the frame 210B.

<<Structure of Frame>>

The frame 210B includes a hinge portion 213B, a first guide portion 211connected to the hinge portion 213B, and a second guide portion 212connected to the hinge portion 213B. The hinge portion 213B has afunction of rotatably connecting the second guide portion 212 to thefirst guide portion 211 (see FIGS. 7A to 7C).

A variety of structures can be used as the hinge portion 213B. Forexample, a structure including a rotation axis 213S and a plurality ofparts 213PB connected to each other with the use of the rotation axis213S can be used (see FIG. 8A).

The hinge portion 213B with the plurality of parts 213PB connected toeach other in such a manner that the parts 213PB spread like a fan canbe used, for example. With the hinge portion 213B, the second guideportion 212 can move rotationally with respect to the first guideportion 211. Specifically, the second guide portion 212 can moverotationally from the state shown in FIG. 8A to the state shown in FIG.8B.

Although the second guide portion 212 can move rotationally with respectto the first guide portion 211 from the state shown in FIG. 7A throughthe state shown in FIG. 7B to the state shown in FIG. 7C, when the part213PB comes in contact with the adjacent part as shown in FIG. 8B, thesecond guide portion 212 cannot go further. The hinge portion 213B thusallows the functional panel 100A to be bent largely toward one side andlimits bending of the functional panel 100A toward the opposite side.

A member selected from the structures that can be used as the frame 210Ato satisfy the above conditions can be used as the frame 210B.

<<Functional Panel>>

The functional panels described in Embodiment 1, for example, can beused. Specifically, the functional panel 100A, the functional panel100A2, the functional panel 100B, the functional panel 100C, thefunctional panel 100D, or the like can be used.

In the case where the functional panel 100B is used, the functionalpanel 100B is positioned such that the first region 7A of the functionalpanel 100B (the region in which the member 4C is positioned) overlapswith the hinge portion 213 of the frame 210B (see FIG. 8C).

In the case where the functional panel 100D is used, the functionalpanel 100D is positioned such that the first region 7A of the functionalpanel 100D (the region in which the member 4C is positioned) overlapswith the hinge portion 213 of the frame 210B (see FIG. 8D).

This embodiment can be combined with any of the other embodiments inthis specification as appropriate.

Embodiment 3

In this embodiment, a method of manufacturing a stack that can be usedin the manufacture of the functional panel of one embodiment of thepresent invention will be described with reference to FIGS. 9A-1 and9A-2, FIGS. 9B-1 and 9B-2, FIG. 9C, FIGS. 9D-1 and 9D-2, and FIGS. 9E-1and 9E-2.

FIGS. 9A-1 to 9E-2 are schematic views illustrating a process ofmanufacturing the stack. Cross-sectional views illustrating structuresof a processed member and the stack are shown on the left side of FIGS.9A-1 to 9E-2, and top views corresponding to the cross-sectional viewsexcept FIG. 9C are shown on the right side.

<Method of Manufacturing Stack>

A method of manufacturing a stack 81 from a processed member 80 will bedescribed with reference to FIGS. 9A-1 to 9E-2.

The processed member 80 includes a first substrate F1, a firstseparation layer F2 on the first substrate F1, a first layer F3 to beseparated whose one surface is in contact with the first separationlayer F2, a bonding layer 30 whose one surface is in contact with theother surface of the first layer F3 to be separated, and a base S5 incontact with the other surface of the bonding layer 30 (see FIGS. 9A-1and 9A-2).

Note that the detailed structure of the processed member 80 will bedescribed in Embodiment 5.

<<Formation of Separation Starting Points>>

The processed member 80 in which separation starting points F3 s areformed in the vicinity of edges of the bonding layer 30 is prepared.

The separation starting point F3 s is formed by separating part of thefirst layer F3 to be separated, from the first substrate F1.

Part of the first layer F3 to be separated can be separated from theseparation layer F2 by inserting a sharp tip into the first layer F3 tobe separated, from the first substrate F1 side, or by a method using alaser or the like (e.g., a laser ablation method). Thus, the separationstarting point F3 s can be formed.

<<First Step>>

The processed member 80 in which the separation starting points F3 s areformed in the vicinity of the edges of the bonding layer 30 in advanceis prepared (see FIGS. 9B-1 and 9B-2).

<<Second Step>>

One surface layer 80 b of the processed member 80 is separated. As aresult, a first remaining portion 80 a is obtained from the processedmember 80.

Specifically, from the separation starting point F3 s formed in thevicinity of the edge of the bonding layer 30, the first substrate F1,together with the first separation layer F2, is separated from the firstlayer F3 to be separated (see FIG. 9C). Consequently, the firstremaining portion 80 a including the first layer F3 to be separated, thebonding layer 30 whose one surface is in contact with the first layer F3to be separated, and the base S5 in contact with the other surface ofthe bonding layer 30 is obtained.

The separation may be performed while the vicinity of the interfacebetween the first separation layer F2 and the first layer F3 to beseparated is irradiated with ions to remove static electricity.Specifically, the ions may be generated by an ionizer.

Furthermore, when the first layer F3 to be separated is separated fromthe first separation layer F2, a liquid is injected into the interfacebetween the first separation layer F2 and the first layer F3 to beseparated. Alternatively, a liquid may be ejected and sprayed by anozzle 99. For example, as the injected liquid or the sprayed liquid,water, a polar solvent, or the like can be used.

By injecting the liquid, an influence of static electricity and the likegenerated with the separation can be reduced. Alternatively, theseparation may be performed while a liquid that dissolves the separationlayer is injected.

In particular, in the case where a film containing tungsten oxide isused as the first separation layer F2, the first layer F3 to beseparated is preferably separated while a liquid containing water isinjected or sprayed because a stress applied to the first layer F3 to beseparated due to the separation can be reduced.

<<Third Step>>

A first adhesive layer 31 is formed on the first remaining portion 80 a(see FIGS. 9D-1 and 9D-2), and the first remaining portion 80 a isbonded to a first support 41 with the first adhesive layer 31.Consequently, the stack 81 is obtained from the first remaining portion80 a.

Specifically, the stack 81 including the first support 41, the firstadhesive layer 31, the first layer F3 to be separated, the bonding layer30 whose one surface is in contact with the first layer F3 to beseparated, and the base S5 in contact with the other surface of thebonding layer 30 is obtained (see FIGS. 9E-1 and 9E-2).

To form the bonding layer 30, any of a variety of methods can be used.For example, the bonding layer 30 can be formed with a dispenser, by ascreen printing method, or the like. The bonding layer 30 is cured by amethod selected in accordance with its material. For example, when alight curable adhesive is used for the bonding layer 30, light includinglight of a predetermined wavelength is emitted.

This embodiment can be combined with any of the other embodimentsdescribed in this specification as appropriate.

Embodiment 4

In this embodiment, a method of manufacturing a stack that can be usedin the manufacture of the functional panel of one embodiment of thepresent invention will be described with reference to FIGS. 10A-1 and10A-2, FIGS. 10B-1 and 10B-2, FIG. 10C, FIGS. 10D-1 and 10D-2, FIGS.10E-1 and 10E-2, FIGS. 11A-1 and 11A-2, FIG. 11B, FIG. 11C, FIGS. 11D-1and 11D-2, and FIGS. 11E-1 and 11E-2.

FIGS. 10A-1 to 10E-2 and FIGS. 11A-1 to 11E-2 are schematic viewsillustrating a process of manufacturing the stack. Cross-sectional viewsillustrating structures of a processed member and the stack are shown onthe left side of FIGS. 10A-1 to 10E-2 and FIGS. 11A-1 to 11E-2, and topviews corresponding to the cross-sectional views except FIG. 10C andFIGS. 11B and 11C are shown on the right side.

<Method of Manufacturing Stack>

A method of manufacturing a stack 92 from a processed member 90 will bedescribed with reference to FIGS. 10A-1 to 10E-2 and FIGS. 11A-1 to11E-2.

The processed member 90 is different from the processed member 80 inthat the other surface of the bonding layer 30 is in contact with onesurface of a second layer S3 to be separated.

Specifically, the difference is that a stack including the secondsubstrate S1, a second separation layer S2 over the second substrate S1,and the second layer S3 to be separated whose other surface is incontact with the second separation layer S2 is provided instead of thebase S5, and that one surface of the second layer S3 to be separated isin contact with the other surface of the bonding layer 30, in theprocessed member 90.

In the processed member 90, the first substrate F1, the first separationlayer F2, the first layer F3 to be separated whose one surface is incontact with the first separation layer F2, the bonding layer 30 whoseone surface is in contact with the other surface of the first layer F3to be separated, the second layer S3 to be separated whose one surfaceis in contact with the other surface of the bonding layer 30, the secondseparation layer S2 whose one surface is in contact with the othersurface of the second layer S3 to be separated, and the second substrateS1 are placed in this order see FIGS. 10A-1 and 10A-2).

Note that the detailed structure of the processed member 90 will bedescribed in Embodiment 5.

<<First Step>>

The processed member 90 in which the separation starting points F3 s areformed in the vicinity of the edges of the bonding layer 30 is prepared(see FIGS. 10B-1 and 10B-2).

The separation starting point F3 s is formed by separating part of thefirst layer F3 to be separated, from the first substrate F1.

For example, part of the first layer F3 to be separated can be separatedfrom the separation layer F2 by inserting a sharp tip into the firstlayer F3 to be separated, from the first substrate F1 side, or by amethod using a laser or the like (e.g., a laser ablation method). Thus,the separation starting point F3 s can be formed.

<<Second Step>>

One surface layer 90 b of the processed member 90 is separated. As aresult, a first remaining portion 90 a is obtained from the processedmember 90.

Specifically, from the separation starting point F3 s formed in thevicinity of the edge of the bonding layer 30, the first substrate F1,together with the first separation layer F2, is separated from the firstlayer F3 to be separated (see FIG. 10C). Consequently, the firstremaining portion 90 a in which the first layer F3 to be separated, thebonding layer 30 whose one surface is in contact with the first layer F3to be separated, the second layer S3 to be separated whose one surfaceis in contact with the other surface of the bonding layer 30, the secondseparation layer S2 Whose one surface is in contact with the othersurface of the second layer S3 to be separated, and the second substrateS1 are placed in this order is obtained.

Note that the separation may be performed while the vicinity of theinterface between the second separation layer S2 and the second layer S3to be separated is irradiated with ions to remove static electricity.Specifically, the ions may be generated by an ionizer.

Furthermore, when the second layer S3 to be separated is separated fromthe second separation layer S2, a liquid is injected into the interfacebetween the second separation layer S2 and the second layer S3 to beseparated. Alternatively, a liquid may be ejected and sprayed by anozzle 99. For example, as the liquid to be injected or the liquid to besprayed, water, a polar solvent, or the like can be used.

By injecting the liquid, an influence of static electricity and the likegenerated with the separation can be reduced. Alternatively, theseparation may be performed while a liquid that dissolves the separationlayer is injected.

In particular, in the case where a film containing tungsten oxide isused as the second separation layer S2, the second layer S3 to beseparated is preferably separated while a liquid containing water isinjected or sprayed because a stress applied to the second layer S3 tobe separated due to the separation can be reduced.

<<Third Step>>

A first adhesive layer 31 is formed on the first remaining portion 90 a(see FIGS. 10D-1 and 10D-2), and the first remaining portion 90 a isbonded to a first support 41 with the first adhesive layer 31.Consequently, a stack 91 is obtained from the first remaining portion 90a.

Specifically, the stack 91 in which the first support 41, the firstadhesive layer 31, the first layer F3 to be separated, the bonding layer30 whose one surface is in contact with the first layer F3 to beseparated, the second layer S3 to be separated whose one surface is incontact with the other surface of the bonding layer 30, the secondseparation layer S2 whose one surface is in contact with the othersurface of the second layer S3 to be separated, and the second substrateS1 are placed in this order is obtained (see FIGS. 10E-1 and 10E-2).

<<Fourth Step>>

Part of the second layer S3 to be separated in the vicinity of the edgeof the first adhesive layer 31 of the stack 91 is separated from thesecond substrate S1 to form a second separation starting point 91 s.

For example, the first support 41 and the first adhesive layer 31 arecut from the first support 41 side, and part of the second layer S3 tobe separated is separated from the second substrate S1 along an edge ofthe first adhesive layer 31 which is newly formed.

Specifically, the first adhesive layer 31 and the first support 41 in aregion which is over the second separation layer S2 and in which thesecond layer S3 to be separated is provided are cut with a blade or thelike including a sharp tip, and along a newly formed edge of the firstadhesive layer 31, the second layer S3 to be separated is partlyseparated from the second substrate S1 (see FIGS. 11A-1 and 11A-2).

Consequently, the separation starting points 91 s are formed in thevicinity of newly formed edges of the first support 41 b and the firstadhesive layer 31.

<<Fifth Step>>

A second remaining portion 91 a is separated from the stack 91. As aresult, the second remaining portion 91 a is obtained from the stack 91(see FIG. 11C).

Specifically, from the separation starting point 91 s formed in thevicinity of the edge of the first adhesive layer 31, the secondsubstrate S1, together with the second separation layer S2, is separatedfrom the second layer S3 to be separated. Consequently, the secondremaining portion 91 a in which the first support 41 b, the firstadhesive layer 31, the first layer F3 to be separated, the bonding layer30 whose one surface is in contact with the first layer F3 to beseparated, and the second layer S3 to be separated whose one surface isin contact with the other surface of the bonding layer 30 are placed inthis order is obtained.

Note that the separation may be performed while the vicinity of theinterface between the second separation layer S2 and the second layer S3to be separated is irradiated with ions to remove static electricity.Specifically, the ions may be generated by an ionizer.

Furthermore, when the second layer S3 to be separated is separated fromthe second separation layer S2, a liquid is injected into the interfacebetween the second separation layer S2 and the second layer S3 to beseparated. Alternatively, a liquid may be ejected and sprayed by anozzle 99. For example, as the liquid to be injected or the liquid to besprayed, water, a polar solvent, or the like can be used.

By injecting the liquid, an influence of static electricity and the likegenerated with the separation can be reduced. Alternatively, theseparation may be performed while a liquid that dissolves the separationlayer is injected.

In particular, in the case where a film containing tungsten oxide isused as the second separation layer S2, the second layer S3 to beseparated is preferably separated while a liquid containing water isinjected or sprayed because a stress applied to the second layer S3 tobe separated due to the separation can be reduced.

<<Sixth Step>>

A second adhesive layer 32 is formed on the second remaining portion 91a (see FIGS. 11D-I and 11D-2).

The second remaining portion 91 a is bonded to the second support 42with the second adhesive layer 32. Consequently, a stack 92 is obtainedfrom the second remaining portion 91 a (see FIGS. 11E-1 and 11E-2).

Specifically, the stack 92 in which first support 41 b, the firstadhesive layer 31, the first layer F3 to be separated, the bonding layer30 whose one surface is in contact with the first layer F3 to beseparated, the second layer S3 to be separated whose one surface is incontact with the other surface of the bonding layer 30, the secondadhesive layer 32, and the second support 42 are placed in this order isobtained.

<Method of Manufacturing Stack Including Opening Portion in Support>

A method of manufacturing a stack including an opening portion in asupport will be described with reference to FIGS. 12A-1 and 12A-2, FIGS.12B-1 and 12B-2, FIGS. 12C-1 and 12C-2, and FIGS. 12D-I and 12D-2.

FIGS. 12A-I to 12D-2 illustrate the method of manufacturing a stackincluding an opening portion which exposes part of a layer to beseparated in a support. Cross-sectional views illustrating structures ofthe stack are shown on the left side of FIGS. 12A-1 to 12D-2, and topviews corresponding to the cross-sectional views are shown on the rightside.

FIGS. 12A-1 to 12B-2 illustrate a method of manufacturing a stack 92 cincluding an opening portion by using a second support 42 b that issmaller than the first support 41 b.

FIGS. 12C-1 to 12D-2 illustrate a method of manufacturing a stack 92 dincluding an opening portion formed in the second support 42.

Example 1 of Method of Manufacturing Stack Including Opening Portion inSupport

This method of manufacturing a stack has the same steps as the aboveexcept that the second support 42 b that is smaller than the firstsupport 41 b is used instead of the second support 42 in the sixth step.By this method, a stack in which part of the second layer S3 to beseparated is exposed can be manufactured (see FIGS. 12A-1 and 12A-2).

As the second adhesive layer 32, a liquid adhesive can be used.Alternatively, an adhesive whose fluidity is inhibited and which isformed in a single wafer shape in advance (also referred to as asheet-like adhesive can be used. By using the sheet-like adhesive, theamount of part of the adhesive layer 32 which extends beyond the secondsupport 42 b can be small. In addition, the adhesive layer 32 can have auniform thickness easily.

Part of the second layer S3 to be separated, which is exposed, may becut off, such that the first layer F3 to be separated is exposed (seeFIGS. 12B-1 and 12B-2).

Specifically, with a blade or the like which has a sharp tip, a slit isformed in the exposed second layer S3 to be separated. Then, forexample, an adhesive tape or the like is attached to part of the exposedsecond layer S3 to be separated to concentrate stress near the slit, andthe part of the exposed second layer S3 to be separated is separatedtogether with the attached tape or the like, whereby the part of thesecond layer S3 to be separated can be selectively removed.

Moreover, a layer that can suppress the bonding power of the bondinglayer 30 to the first layer F3 to be separated may be selectively formedon part of the first layer F3 to be separated. For example, a materialthat is not easily bonded to the bonding layer 30 may be selectivelyformed. Specifically, an organic material may be deposited into anisland shape. Thus, part of the bonding layer 30 can be selectivelyremoved together with the second layer S3 to be separated easily. As aresult, the first layer F3 to be separated can be exposed.

Note that for example, in the case where the first layer F3 to beseparated includes a functional layer and a conductive layer F3 belectrically connected to the functional layer, the conductive layer F3b can be exposed in an opening portion in the second stack 92 c. Thus,the conductive layer F3 b exposed in the opening portion can be used asa terminal supplied with a signal.

As a result, the conductive layer F3 b part of which is exposed in theopening portion can be used as a terminal that can extract a signalsupplied though the functional layer, or can be used as a terminal towhich a signal supplied to the functional layer can be supplied by anexternal device.

Example 2 of Method of Manufacturing Stack Including Opening Portion inSupport

A mask 48 including an opening portion formed to overlap with an openingportion formed in the second support 42 is formed on the stack 92. Next,a solvent 49 is dropped into the opening portion in the mask 48. Thus,with the solvent 49, the second support 42 exposed in the openingportion in the mask 48 can be swelled or dissolved (see FIGS. 12C-1 and12C-2).

After the extra solvent 49 is removed, stress is applied by, forexample, rubbing the second support 42 exposed in the opening portion inthe mask 48. Thus, the second support 42 or the like in a region thatoverlaps with the opening portion in the mask 48 can be removed.

Moreover, with a solvent with which the bonding layer 30 is swelled ordissolved, the first layer F3 to be separated can be exposed (see FIGS.12D-1 and 12D-2).

This embodiment can be combined with any of the other embodimentsdescribed in this specification as appropriate.

Embodiment 5

In this embodiment, a structure of a processed member that can beprocessed into the functional panel of one embodiment of the presentinvention will be described with reference to FIGS. 13A-1 and 13A-2 andFIGS. 13B-1 and 13B-2.

FIGS. 13A-1 to 13B-2 are schematic views illustrating a structure of aprocessed member that can be processed into the stack.

FIG. 13A-1 is a cross-sectional view illustrating a structure of theprocessed member 80 which can be processed into the stack, and FIG.13A-2 is a top view corresponding to the cross-sectional view.

FIG. 13B-1 is a cross-sectional view illustrating a structure of theprocessed member 90 which can be processed into the stack, and FIG.13B-2 is a top view corresponding to the cross-sectional view.

Structural Example 1 of Processed Member

The processed member 80 includes the first substrate F1, the firstseparation layer F2 on the first substrate F1, the first layer F3 to beseparated whose one surface is in contact with the first separationlayer F2, the bonding layer 30 whose one surface is in contact with theother surface of the first layer F3 to be separated, and the base S5 incontact with the other surface of the bonding layer 30 (see FIGS. 13A-1and 13A-2).

Note that the separation starting points F3 s may be formed in thevicinity of the edges of the bonding layer 30.

<<First Substrate>>

There is no particular limitation on the first substrate F1 as long asit has heat resistance high enough to withstand a manufacturing processand a thickness and a size that allow the first substrate F1 to beplaced in a manufacturing apparatus.

For the first substrate F1, an organic material, an inorganic material,a composite material of an organic material and an inorganic material,or the like can be used.

For example, an inorganic material such as glass, ceramic, or metal, canbe used for the first substrate F1.

Specifically, non-alkali glass, soda-lime glass, potash glass, crystalglass, or the like can be used for the first substrate F1.

Specifically, a metal oxide film, a metal nitride film, a metaloxynitride film, or the like can be used for the first substrate F1. Forexample, silicon oxide, silicon nitride, silicon oxynitride, an aluminafilm, or the like can be used for the first substrate F1.

Specifically, SUS, aluminum, or the like can be used for the firstsubstrate F1.

For example, an organic material such as a resin, a resin film, or aplastic can be used for the first substrate F1.

Specifically, a resin film or a resin plate of polyester, polyolefin,polyamide, polyimide, polycarbonate, an acrylic resin, or the like canbe used for the first substrate F1.

For example, a composite material such as a resin film to which a metalplate, a thin glass plate, or a film of an inorganic material isattached can be used as the first substrate F1.

For example, a composite material formed by dispersing a fibrous orparticulate metal, glass, inorganic material, or the like into a resinfilm can be used as the first substrate F1.

For example, a composite material formed by dispersing a fibrous orparticulate resin, organic material, or the like into an inorganicmaterial can be used as the first substrate F1.

For the first substrate F1, a single-layer material or a stacked-layermaterial in which a plurality of layers are stacked can be used. Forexample, a stacked-layer material in which a base, an insulating layerthat prevents the diffusion of impurities contained in the base, and thelike are stacked can be used for the first substrate F1.

Specifically, a stacked-layer material in which glass and one or aplurality of films that prevents the diffusion of impurities containedin the glass and that are selected from a silicon oxide film, a siliconnitride film, a silicon oxynitride film, and the like are stacked can beused for the first substrate F1.

Alternatively, a stacked-layer material including a resin and a filmthat prevents the diffusion of impurities passing through the resin,such as a silicon oxide film, a silicon nitride film, or a siliconoxynitride film, can be used for the first substrate F1.

<<First Separation Layer>>

The first separation layer F2 is provided between the first substrate F1and the first layer F3 to be separated. In the vicinity of the firstseparation layer F2, a boundary where the first layer F3 to be separatedcan be separated from the first substrate F1 is formed. There is noparticular limitation on the first separation layer F2 as long as it hasheat resistance high enough to withstand the manufacturing process ofthe first layer F3 to be separated formed thereon.

For the first separation layer F2, for example, an inorganic material,an organic resin, or the like can be used.

Specifically, an inorganic material such as a metal containing anelement selected from tungsten, molybdenum, titanium, tantalum, niobium,nickel, cobalt, zirconium, zinc, ruthenium, rhodium, palladium, osmium,iridium, and silicon, an alloy containing the element, or a compoundcontaining the element can be used for the first separation layer F2.

Specifically, an organic material such as polyimide, polyester,polyolefin, polyimide, polycarbonate, or an acrylic resin can be used.

For example, a single-layer material or a stacked-layer material inwhich a plurality of layers are stacked can be used for the firstseparation layer F2.

Specifically, a material in which a layer containing tungsten and alayer containing an oxide of tungsten are stacked can be used for thefirst separation layer F2.

The layer containing an oxide of tungsten can be formed by a method inwhich another layer is stacked on a layer containing tungsten.Specifically, the layer containing an oxide of tungsten may be formed bya method in which silicon oxide, silicon oxynitride, or the like isstacked on a layer containing tungsten.

The layer containing an oxide of tungsten may be formed by subjecting asurface of a layer containing tungsten to thermal oxidation treatment,oxygen plasma treatment, nitrous oxide (N₂O) plasma treatment, treatmentwith a solution with high oxidizing power (e.g., ozone water), or thelike.

Specifically, a layer containing polyimide can be used as the firstseparation layer F2. The layer containing polyimide has heat resistancehigh enough to withstand the various manufacturing steps required toform the first layer F3 to be separated.

For example, the layer containing polyimide has heat resistance of 200°C. or higher, preferably 250° C. or higher, more preferably 300 CC orhigher, still more preferably 350° C. or higher.

By heating a film containing a monomer formed on the first substrate F1,a film containing polyimide obtained by condensation of the monomer canbe obtained. Such a film can be used as the layer containing polyimide.

<<First Layer to be Separated>>

There is no particular limitation on the first layer F3 to be separatedas long as it can be separated from the first substrate F1 and has heatresistance high enough to withstand the manufacturing process.

The boundary where the first layer F3 to be separated can be separatedfrom the first substrate F1 may be formed between the first layer F3 tobe separated and the first separation layer F2 or may be formed betweenthe first separation layer F2 and the first substrate F1.

In the case where the boundary is formed between the first layer F3 tobe separated and the first separation layer F2, the first separationlayer F2 is not included in the stack. In the case where the boundary isformed between the first separation layer F2 and the first substrate F1,the first separation layer F2 is included in the stack.

An inorganic material, an organic material, a single-layer material, astacked-layer material in which a plurality of layers are stacked, orthe like can be used for the first layer F3 to be separated.

For example, an inorganic material such as a metal oxide film, a metalnitride film, or a metal oxynitride film can be used for the first layerF3 to be separated.

Specifically, silicon oxide, silicon nitride, silicon oxynitride, analumina film, or the like can be used for the first layer F3 to beseparated.

Specifically, a resin, a resin film, plastic, or the like can be usedfor the first layer F3 to be separated.

Specifically, a polyimide film or the like can be used for the firstlayer F3 to be separated.

For example, a material having a structure in which a functional layerhaving a region that overlaps with the first separation layer F2 and aninsulating layer that is provided between the first separation layer F2and the functional layer and can prevent the diffusion of impuritieswhich impair the function of the functional layer are stacked can beused.

Specifically, a 0.7-mm-thick glass plate is used as the first substrateF1, and a stacked-layer material in which a 200-nm-thick siliconoxynitride film and a 30-nm-thick tungsten film are stacked in thisorder from the first substrate F1 side is used for the first separationlayer F2. In addition, a film including a stacked-layer material inwhich a 600-nm-thick silicon oxynitride film and a 200-nm-thick siliconnitride film are stacked in this order from the first separation layerF2 side can be used as the first layer F3 to be separated. Note that asilicon oxynitride film refers to a film that includes more oxygen thannitrogen, and a silicon nitride oxide film refers to a film thatincludes more nitrogen than oxygen.

Specifically, instead of the above first layer F3 to be separated, afilm including a stacked-layer material of a 600-nm-thick siliconoxynitride film, a 200-nm-thick silicon nitride film, a 200-nm-thicksilicon oxynitride film, a 140-nm-thick silicon nitride oxide film, anda 100-nm-thick silicon oxynitride film stacked in this order from thefirst separation layer F2 side can be used as the first layer F3 to beseparated.

Specifically, a stacked-layer material in which a polyimide film, alayer containing silicon oxide, silicon nitride, or the like and thefunctional layer are stacked in this order from the first separationlayer F2 side can be used.

<<Functional Layer>>

The functional layer is included in the first layer F3 to be separated.

For example, a functional circuit, a functional element, an opticalelement, a functional film, or a layer including a plurality of elementsselected from these can be used as the functional layer.

Specifically, a display element that can be used for a display device, apixel circuit driving the display element, a driver circuit driving thepixel circuit, a color filter, a moisture-proof film, and the like, anda layer including two or more selected from these can be given.

<<Bonding Layer>>

There is no particular limitation on the bonding layer 30 as long as itbonds the first layer F3 to be separated and the base S5 to each other.

For the bonding layer 30, an inorganic material, an organic material, acomposite material of an inorganic material and an organic material, orthe like can be used.

For example, a glass layer with a melting point of 400° C. or lower,preferably 300° C. or lower, an adhesive, or the like can be used.

For example, an organic material such as a light curable adhesive, areactive curable adhesive, a thermosetting adhesive, and/or an anaerobicadhesive can be used for the bonding layer 30.

Specifically, an adhesive containing an epoxy resin, an acrylic resin, asilicone resin, a phenol resin, a polyimide resin, an imide resin, apolyvinyl chloride (PVC) resin, a polyvinyl butyral (PVB) resin, and anethylene vinyl acetate (EVA) resin, or the like can be used.

<<Base>>

There is no particular limitation on the base S5 as long as it has heatresistance high enough to withstand a manufacturing process and athickness and a size that allow the base S5 to be placed in amanufacturing apparatus.

A material that can be used for the base S5 can be the same as that ofthe first substrate F1, for example.

<<Separation Starting Point>>

In the processed member 80, the separation starting point F3 s may beformed in the vicinity of the edges of the bonding layer 30.

The separation starting point F3 s is formed by separating part of thefirst layer F3 to be separated, from the first substrate F1.

Part of the first layer F3 to be separated can be separated from theseparation layer F2 by inserting a sharp tip into the first layer F3 tobe separated, from the first substrate F1 side, or by a method using alaser or the like (e.g., a laser ablation method). Thus, the separationstarting point F3 s can be formed.

Structural Example 2 of Processed Member

A structure of the processed member that can be the stack and isdifferent from the above will be described with reference to FIGS. 13B-1and 13B-2.

The processed member 90 is different from the processed member 80 inthat the other surface of the bonding layer 30 is in contact with onesurface of the second layer S3 to be separated instead of the base S5.

Specifically, the processed member 90 includes the first substrate F1 onwhich the first separation layer F2 and the first layer F3 to beseparated whose one surface is in contact with the first separationlayer F2 are formed, the second substrate S1 on which the secondseparation layer S2 and the second layer S3 to be separated whose othersurface is in contact with the second separation layer S2 are formed,and the bonding layer 30 whose one surface is in contact with the othersurface of the first layer F3 to be separated and whose other surface isin contact with the one surface of the second layer S3 to be separated(see FIGS. 13B-1 and 13B-2).

<<Second Substrate>>

As the second substrate S1, a substrate similar to the first substrateF1 can be used. Note that the second substrate S1 need not necessarilyhave the same structure as the first substrate F1.

<<Second Separation Layer>>

For the second separation layer S2, a structure similar to that of thefirst separation layer F2 can be used. For the second separation layerS2, a structure different from that of the first separation layer F2 canalso be used.

<<Second Layer to be Separated>>

As the second layer S3 to be separated, a structure similar to that ofthe first layer F3 to be separated can be used. For the second layer S3to be separated, a structure different from that of the first layer F3to be separated can also be used.

Specifically, a structure may be employed in which the first layer F3 tobe separated includes a functional circuit and the second layer S3 to beseparated includes a functional layer that prevents the diffusion ofimpurities into the functional circuit.

Specifically, a structure may be employed in which the first layer F3 tobe separated includes a light-emitting element that emits light to thesecond layer S3 to be separated, a pixel circuit driving thelight-emitting element, and a driver circuit driving the pixel circuit,and the second layer S3 to be separated includes a color filter thattransmits part of light emitted from the light-emitting element and amoisture-proof film that prevents the diffusion of impurities into thelight-emitting element. Note that the processed member with such astructure can be used for a stack that can be used as a flexible displaydevice.

This embodiment can be combined with any of the other embodiments inthis specification as appropriate.

Embodiment 6

In this embodiment, the structure of an input/output device will bedescribed as an example of the structure of a functional panel of oneembodiment of the present invention, with reference to FIG. 14, FIGS.15A to 15C, FIG. 24, FIG. 25. FIG. 26, and FIG. 27.

FIG. 14 is a projection view illustrating the structure of aninput/output device 500TP of one embodiment of the present invention.Note that for convenience of description, part of a sensor panel 600 andpart of a pixel 502 are enlarged.

FIG. 15A is a cross-sectional view of a portion of the input/outputdevice 500TP of one embodiment of the present invention in FIG. 14 takenalong the line Z1-Z2. FIGS. 15B and 15C are each a cross-sectional viewof a structure that can replace part of the structure shown in FIG. 15A.

FIG. 24 is a cross-sectional view illustrating the structure of aninput/output device 500TP(1) of one embodiment of the present invention,in which part of the structure shown in FIG. 15A is replaced.

FIG. 25 is a cross-sectional view illustrating the structure of aninput/output device 500TP(2) of one embodiment of the present invention,in which part of the structure shown in FIG. 15A is replaced.

FIG. 26 is a cross-sectional view illustrating the structure of aninput/output device 500TP(3) of one embodiment of the present invention,in which part of the structure shown in FIG. 15A is replaced.

FIG. 27 is a cross-sectional view illustrating the structure of aninput/output device 500TP(4) of one embodiment of the present invention,in which part of the structure shown in FIG. 15A is replaced.

Structural Example 1 of Input/Output Device

The input/output device 500TP described in this embodiment includes adisplay panel 500 and the sensor panel 600 overlapping with the displaypanel 500 (see FIG. 14).

The sensor panel 600 can be supplied with a control signal and supply asensing signal. Further, the sensor panel 600 can be in a folded statewith the first plane inside and in an unfolded state.

The sensor panel 600 includes a plurality of control lines including acontrol line CL(i) supplied with a control signal and extending in therow direction. The sensor panel 600 also includes a plurality of signallines including a signal line ML(j) extending in the column directionand supplying a sensing signal, in addition, the sensor panel 600includes a flexible base 610 supporting the control line CL(i) and thesignal line ML(j).

The sensor panel 600 includes a first electrode C1(i) electricallyconnected to the control line CL(i) and a second electrode C2(j)electrically connected to the signal line ML(j) and including a portionnot overlapping with the first electrode C1(i).

The base 610 supports the first electrode C1(i) and the second electrodeC2(j).

The display panel 500 includes the pixel 502.

The first electrode C1(i) or the second electrode C2(j) includes anet-like conductive film having opening portions 667 at positionsoverlapping with the pixels 502.

The input/output device 500TP described in this embodiment includes thesensor panel 600 and the display panel 500 that overlaps with the sensorpanel 600 and can be folded and unfolded together with the sensor panel600. The first electrode or the second electrode includes a net-likeconductive film having opening portions at positions overlapping withthe pixels of the display panel.

The sensor panel 600 of the input/output device 500TP can supply thesensing data together with the positional data, for example.

Specifically, a user of the input/output device 500TP can make variousgestures (e.g., tap, drag, swipe, and pinch in) using his/her finger orthe like that approaches or is in contact with the sensor panel 600 as apointer.

The sensor panel 600 is capable of sensing approach or contact of afinger or the like to the sensor panel 600 and supplying sensing dataincluding the obtained position, track, or the like.

An arithmetic unit judges whether or not supplied data satisfies apredetermined condition, and executes instructions associated with apredetermined gesture on the basis of a program or the like.

Thus, a user of the sensor panel 600 can make the predetermined gestureand make the arithmetic unit execute instructions associated with thepredetermined gesture.

The display panel 500 of the input/output device 500TP has a function ofbeing supplied with display data V from, for example, the arithmeticunit.

The input/output device 500TP can include the following structures inaddition to the above structures.

A flexible printed circuit FPC1 may be electrically connected to thesensor panel 600 of the input/output device 500TP.

A flexible printed circuit FPC2 may be electrically connected to thedisplay panel 500 of the input/output device 500TP.

The display panel 500 can include a driver circuit 503 g or a drivercircuit 503 s.

The display panel 500 can include a wiring 511 or a terminal 519.

The input/output device 500TP can include a protective layer 670.

The input/output device 500TP can include an anti-reflection layer 670 phaving a region overlapping with the pixel 502.

Individual components included in the input/output device 500TP will bedescribed below. Note that these components cannot be clearlydistinguished and one component also serves as another component orinclude part of another component in some cases.

For example, the sensor panel 600 including the coloring layersoverlapping with the plurality of opening portions 667 also serves as acolor filter.

Further, for example, the input/output device 500TP in which the sensorpanel 600 is provided over the display panel 500 serves as the sensorpanel 600 and also the display panel 500. Note that the input/outputdevice 500TP in which the sensor panel 600 is provided over the displaypanel 500 is also referred to as a touch panel.

<Overall Structure>

The input/output device 500TP described in this embodiment includes thesensor panel 600 or the display panel 500.

An example of a method for manufacturing a stack that can be used formanufacturing the input/output device 500TP will be described in detailin Embodiments 3 to 5.

<<Sensor Panel>>

The sensor panel 600 includes the control line CL(i), the signal ML(j),or the base 610 (see FIG. 14).

The sensor panel 600 may be formed in such a manner that films forforming the sensor panel 600 are deposited over the base 610 and thefilms are processed.

Alternatively, the sensor panel 600 may be formed in such a manner thatpart of the sensor panel 600 is formed over another base, and the partis transferred to the base 610.

The sensor panel 600 senses an object which approaches or touches thesensor panel 600 and supplies a sensing signal. For example, the sensorpanel 600 senses changes in capacitance, illuminance, magnetic force, aradio wave, pressure, or the like and supplies data based on the sensedphysical quantity. Specifically, a capacitor, a photoelectric conversionelement, a magnetic sensor element, a piezoelectric element, aresonator, or the like can be used as a sensor element.

Note that in the air, when a finger or the like whose dielectricconstant is larger than that of the air is close to the conductive film,capacitance between the finger and the conductive film is changed. Thesensor panel 600 can sense the change in capacitance and supply sensingdata. Specifically, a conductive film, a capacitor one electrode ofwhich is connected to the conductive film, and the like can be used.

For example, distribution of charge occurs between the conductive filmand the capacitor owing to the change in capacitance, so that thevoltage between the pair of electrodes of the capacitor is changed. Thisvoltage change can be used as the sensing

<<Wiring>>

The sensor panel 600 includes wirings. The wirings include the controlline CL(i), the signal line ML(j), and the like.

A conductive material can be used for the wirings and the like.

For example, an inorganic conductive material, an organic conductivematerial, metal, conductive ceramic, or the like can be used for thewiring.

Specifically, a metal element selected from aluminum, gold, platinum,silver, chromium, tantalum, titanium, molybdenum, tungsten, nickel,iron, cobalt, yttrium, zirconium, palladium, and manganese; an alloyincluding any of the above metal elements; an alloy including any of theabove metal elements in combination; or the like can be used for thewiring. In particular, one or more elements selected from aluminum,chromium, copper, tantalum, titanium, molybdenum, and tungsten arepreferably included. In particular, an alloy of copper and manganese issuitably used in microfabrication with the use of a wet etching method.

Specifically, a two-layer structure in which a titanium film is stackedover an aluminum film, a two-layer structure in which a titanium film isstacked over a titanium nitride film, a two-layer structure in which atungsten film is stacked over a titanium nitride film, a two-layerstructure in which a tungsten film is stacked over a tantalum nitridefilm or a tungsten nitride film, a three-layer structure in which atitanium film, an aluminum film, and a titanium film are stacked in thisorder, or the like can be used.

Specifically, an alloy film or a nitride film in which aluminum and oneor more elements selected from titanium, tantalum, tungsten, molybdenum,chromium, neodymium, and scandium are combined can be used.

Alternatively, a conductive oxide such as indium oxide, indium tinoxide, indium zinc oxide, zinc oxide, or zinc oxide to which gallium isadded can be used.

Alternatively, graphene or graphite can be used. A film includinggraphene can be formed, for example, by reducing a film containinggraphene oxide. As a reducing method, a method using heat, a methodusing a reducing agent, or the like can be employed.

Alternatively, a conductive macromolecule can be used.

<<Base>>

There is no particular limitation on the base 610 as long as the base610 has heat resistance high enough to withstand a manufacturing processand a thickness and a size that allow the base 610 to be placed in amanufacturing apparatus. In particular, use of a flexible material asthe base 610 enables the sensor panel 600 to be folded or unfolded. Notethat in the case where the sensor panel 600 is positioned on a sidewhere the display panel 500 displays an image, a light-transmittingmaterial is used for the base 610.

For the base 610, an organic material, an inorganic material, acomposite material of an organic material and an inorganic material, orthe like can be used.

For example, an inorganic material such as glass, ceramic, or metal canbe used for the base 610.

Specifically, non-alkali glass, soda-lime glass, potash glass, crystalglass, or the like can be used for the base 610.

Specifically, a metal oxide film, a metal nitride film, a metaloxynitride film, or the like can be used for the base 610. For example,silicon oxide, silicon nitride, silicon oxynitride, an alumina film, orthe like can be used for the base 610.

For example, an organic material such as a resin, a resin film, orplastic can be used for the base 610.

Specifically, a resin film or resin plate of polyester, polyolefin,polyamide, polyimide, polycarbonate, an acrylic resin, or the like canbe used for the base 610.

For example, a composite material such as a resin film to which a thinglass plate or a film of an inorganic material is attached can be usedas the base 610.

For example, a composite material formed by dispersing a fibrous orparticulate metal, glass, inorganic material, or the like into a resinfilm can be used as the base 610.

For example, a composite material formed by dispersing a fibrous orparticulate resin, organic material, or the like into an inorganicmaterial can be used as the base 610.

A single-layer material or a stacked-layer material in which a pluralityof layers are stacked can be used for the base 610. For example, astacked-layer material including a base material and an insulating layerthat prevents the diffusion of impurities contained in the base materialcan be used for the base 610.

Specifically, a stacked-layer material in which glass and one or aplurality of films that prevent the diffusion of impurities contained inthe glass and that are selected from a silicon oxide film, a siliconnitride film, a silicon oxynitride film, and the like are stacked can beused for the base 610.

Alternatively, a stacked-layer material in which a resin and a film thatprevents the diffusion of impurities contained in the resin, such as asilicon oxide film, a silicon nitride film, a silicon oxynitride film,and the like are stacked can be used for the base 610.

Specifically, a stack including a base 610 b having flexibility, abarrier film 610 a inhibiting the diffusion of impurities, and a resinlayer 610 c attaching the base 610 b to the barrier film 610 a can beused (see FIG. 15A),

<<Flexible Printed Circuit>>

The flexible printed circuit FPC1 supplies a timing signal, a powersupply potential, and the like, and is supplied with a sensing signal(see FIG. 14).

<<Display Panel>>

The display panel 500 includes the pixel 502, scan lines, signal lines,or the base 510.

The display panel 500 may be formed in such a manner that films forforming the display panel 500 are deposited over the base 510 and thefilms are processed.

Alternatively, the display panel 500 may also be formed in such a mannerthat part of the display panel 500 is formed over another base and thepart is transferred to the base 510.

<<Pixel>>

The pixel 502 includes a sub-pixel 502B, a sub-pixel 502G, and asub-pixel 502R, and each sub-pixel includes a display element and apixel circuit for driving the display element.

<<Circuit>>

An active matrix method in which an active element is included in apixel or a passive matrix method in which an active element is notincluded in a pixel can be employed for the display panel 500.

A variety of active elements (non-linear elements) can be used as anactive element (a non-linear element) in the active matrix method. Forexample, a transistor, a metal insulator metal (MIM), a thin film diode(TFD), or the like can be used. Since these elements can be formed witha smaller number of manufacturing steps, manufacturing cost can bereduced or yield can be improved. Alternatively, since the size of theelement is small, the aperture ratio can be improved, so that powerconsumption can be reduced or higher luminance can be achieved.

A passive matrix method in which an active element (a non-linearelement) is not used can also be used. Since an active element (anon-linear element) is not used, the manufacturing process can besimplified, whereby manufacturing cost can be reduced or yield can beimproved. Alternatively, since an active element (a non-linear element)is not used, the aperture ratio can be improved, so that powerconsumption can be reduced or higher luminance can be achieved.

A transistor 502 t can be used in the pixel circuit, for example (seeFIG. 15A).

The display panel 500 includes an insulating film 521 covering thetransistor 502 t.

A film that is thicker than the height of unevenness caused by thestructure of the pixel circuit can be used as the insulating film 521,whereby the unevenness caused by the pixel circuit can be covered.

A stacked-layer film including a film that can prevent the diffusion ofimpurities can be used as the insulating film 521, whereby decrease inreliability of the transistor 502 t or the like due to the diffusion ofimpurities can be prevented.

<<Display Element>>

A variety of display elements can be used for the display panel 500. Forexample, display elements (electronic ink) that perform display by anelectrophoretic method, an electronic liquid powder (registeredtrademark) method, an electrowetting method, or the like, MEMS shutterdisplay elements, optical interference type MEMS display elements, andliquid crystal elements can be used.

Furthermore, a display element that can be used for a transmissiveliquid crystal display, a transflective liquid crystal display, areflective liquid crystal display, a direct-view liquid crystal display,or the like can be used.

Organic electroluminescent elements that emit light of different colorsmay be included in subpixels, for example.

An organic electroluminescent element that emits white light can beused, for example.

A light-emitting element 550R includes a lower electrode, an upperelectrode, and a layer containing a light-emitting organic compoundbetween the lower electrode and the upper electrode, for example.

The sub-pixel 502R includes a light-emitting module 580R. The sub-pixel502R includes the light-emitting element 550R and the pixel circuit thatcan supply electric power to the light-emitting element 550R andincludes a transistor 502 t. The light-emitting module 580R includes thelight-emitting element 550R and an optical element (e.g., the coloringlayer CFR).

Note that to efficiently extract light having a predeterminedwavelength, a microresonator structure may be provided in thelight-emitting module 580R. Specifically, a layer containing alight-emitting organic compound may be provided between a film thatreflects visible light and a film that semi-reflects and semi-transmitsvisible light so that light of a particular wavelength can be extractedefficiently.

The light-emitting module 580R includes the coloring layer CFR on thelight extraction side. The coloring layer transmits light of aparticular wavelength and is, for example, the coloring layer CFR thatselectively transmits light of red, a coloring layer CFG thatselectively transmits light of green, a coloring layer CFB thatselectively transmits light of blue, or a coloring layer thatselectively transmits light of yellow or the like. Note that othersub-pixels may be provided so as to overlap with the window portions,which are not provided with the coloring layers, so that light from thelight-emitting element can be emitted without passing through thecoloring layers.

The coloring layer CFR is positioned in a region overlapping with thelight-emitting element 550R. Accordingly, part of light emitted from thelight-emitting element 550R passes through the coloring layer CFR and isemitted to the outside of the light-emitting module 580R as indicated byan arrow in FIG. 15A.

A light-blocking layer BM is located so as to surround the coloringlayer (e.g., the coloring layer CFR).

Note that in the case where a sealant 560 is provided on a side fromwhich light is extracted, the sealant 560 may be in contact with thelight-emitting element 550R and the coloring layer CFR.

The lower electrode is provided over the insulating film 521. Apartition 528 that includes an opening portion overlapping with thelower electrode is provided. Note that part of the partition 528overlaps with an end portion of the lower electrode.

The lower electrode and the upper electrode sandwich the layercontaining a light-emitting organic compound to constitute thelight-emitting element (e.g., the light-emitting element 550R). Thepixel circuit supplies power to the light-emitting element.

Over the partition 528, a spacer that controls the gap between the base610 and the base 510 is provided.

For a transflective liquid crystal display or a reflective liquidcrystal display, some of or all of pixel electrodes function asreflective electrodes. For example, some or all of pixel electrodes areformed to contain aluminum, silver, or the like.

A memory circuit such as an SRAM can be provided below the reflectiveelectrodes; whereby power consumption can be reduced. A structuresuitable for employed display elements can be selected from among avariety of structures of pixel circuits.

<<Base>>

A flexible material can be used for the base 510. For example, amaterial which is similar to the material that can be used for the base610 can be used for the base 510.

Note that in the case where the base 510 need not have alight-transmitting property, for example, a colored material, a materialwhich does not have a light-emitting property, specifically, a resincolored with yellow or the like, SUS, aluminum, or the like, can beused.

A stack in which a flexible base 510 b, a barrier film 510 a thatprevents the diffusion of impurities, and a resin layer 510 c that bondsthe barrier film 510 a to the base 510 b are stacked can be favorablyused as the base 510, for example (see FIG. 15A).

<<Sealant>>

The sealant 560 bonds the base 610 to the base 510. A material with arefractive index higher than 1.1 can be used for the sealant 560, forexample. In the case where light is extracted to the sealant 560 side,the sealant 560 also serves as an optical adhesive layer. For example, amaterial that can be used for the sealant 560 is a material whoserefractive index is higher than that of air, preferably a material whoserefractive index is higher than or equal to 1.1, further preferably amaterial whose refractive index is higher than or equal to 1.2.

Note that the pixel circuits or the light-emitting elements (e.g., thelight-emitting element 550R) are provided between the base 510 and thebase 610.

<<Structure of Driver Circuit>>

The driver circuit 503 g supplies a selection signal. For example, thedriver circuit 503 g supplies a selection signal to the scan line (seeFIG. 14).

The driver circuit 503 s may be provided. The driver circuit 503 ssupplies an image signal.

A shift register, a flip flop circuit, a combination circuit, or thelike can be used as the driver circuit 503 g or the driver circuit 503s, for example.

A transistor 503 t or a capacitor 503 c can be included in the drivercircuit 503 s, for example.

Note that transistors used in the pixel circuit and the driver circuitcan be formed in the same process and over the same substrate.

<<Wiring>>

The display panel 500 includes wirings such as scan lines, signal lines,and power supply lines. A variety of conductive films can be used. Forexample, a material similar to that of the conductive film that can beused in the sensor panel 600 can be used.

The display panel 500 includes a wiring 511 through which a signal canbe supplied. The wiring. 511 is provided with a terminal 519. Note thatthe flexible printed circuit FPC2 through which a signal such as animage signal or a synchronization signal can be supplied is electricallyconnected to the terminal 519.

Note that a printed wiring board (PWB) may be attached to the flexibleprinted circuit FPC2.

<<Other Components>>

For example, a ceramic coat layer or a hard coat layer can be used asthe protective layer 670. Specifically, a layer containing aluminumoxide or a layer containing a UV curable resin can be used. With such aprotective layer, a scratch can be prevented from being made and theinput/output device 500TP can be protected.

A circularly polarizing plate, for example, can be used as theanti-reflection layer 670 p, whereby the intensity of outside lightreflected by the input/output device 500TP can be reduced.

Modification Example of Input/Output Device

A variety of transistors can be used for the sensor panel 600 and/or thedisplay panel 500.

A structure of the case in which bottom-gate transistors are included inthe display panel 500 is illustrated in FIGS. 15A and 15B.

A semiconductor layer containing an oxide semiconductor, amorphoussilicon, or the like, for example, can be used in the transistor 502 tand the transistor 503 t illustrated in FIG. 15A.

For example, a semiconductor layer containing polycrystalline siliconthat is obtained by crystallization process such as laser annealing canbe used in the transistor 502 t and the transistor 503 t illustrated inFIG. 15B.

A structure of the case in which top-gate transistors are included inthe display panel 500 is illustrated in FIG. 15C.

A semiconductor layer containing polycrystalline silicon, a singlecrystal silicon film that is transferred from a single crystal siliconsubstrate, or the like, for example, can be used in the transistor 502 tand the transistor 503 t illustrated in FIG. 15C.

Structural Example 2 of Input/Output Device

The structure of the input/output device 500TP(1) of one embodiment ofthe present invention will be described with reference to FIG. 24.

The input/output device 500TP(1) includes a surface of a sensor panel600, which corresponds to a first plane 1, a surface of a display panel500, which corresponds to a second plane 2 that is opposite the firstplane 1, a neutral plane 5A in a region between the first plane 1 andthe second plane 2, a functional layer 3 at least a portion of which isin a region between the first plane 1 and the neutral plane 5A, and asupport (a base 510 and a base 610) that supports the functional layer3.

The functional layer 3 including a subpixel 502R is between the neutralplane 5A and the first plane 1.

A material having a higher rigidity than a base 610 b is used for a base510 b, for example, whereby the neutral plane 5A can be closer to thebase 510 b. Then, the functional layer 3 including the subpixel 502R canbe provided between the neutral plane 5A and the first plane 1.

Structural Example 3 of Input/Output Device

The structure of the input/output device 500TP(2) of one embodiment ofthe present invention will be described with reference to FIG. 25.

The input/output device 500TP(2) includes a first region 7A thatoverlaps with a portion of the functional layer 3 and a second region 7Badjacent to the first region 7A. A support includes a base 510 d in aregion between a second plane 2 in the first region 7A and thefunctional layer 3 and a base 510 b in a region between the second plane2 in the second region 7B and the functional layer 3. The base 510 d hasa higher rigidity than the base 510 b.

Structural Example 4 of Input/Output Device

The structure of the input/output device 500TP(3) of one embodiment ofthe present invention will be described with reference to FIG. 26.

The input/output device 500TP(3) includes a first plane 1, a secondplane 2 that is opposite the first plane 1, a middle plane 5C located inthe middle of a region between the first plane 1 and the second plane 2,a functional layer 3 at least a portion of which is in a region betweenthe first plane 1 and the middle plane 5C, and a support (a base 510 anda base 610) that supports the functional layer 3.

The functional layer 3 including a subpixel 502R is between the middleplane 5C and the first plane 1.

A portion of the input/output device 500TP(3) in a region between thefirst plane 1 and the middle plane 5C has a rigidity approximately equalto that of a portion of the input/output device 500TP(3) in a regionbetween the second plane 2 and the middle plane 5C.

Structural Example 5 of Input/Output Device

The structure of the input/output device 500TP(4) of one embodiment ofthe present invention will be described with reference to FIG. 27.

The input/output device 500TP(4) includes a first region 7A thatoverlaps with a portion of a functional layer 3 and a second region 7Badjacent to the first region 7A. A support includes a base 510 d in aregion between a second plane 2 in the first region 7A and thefunctional layer 3 and a base 510 b in a region between the second plane2 in the second region 7B and the functional layer 3. The base 510 d isthicker than the base 510 b.

Structural Example 6 of Input/Output Device

The structure of an electrode that can be included in the sensor panel600 of the input/output device 500TP of one embodiment of the presentinvention will be described with reference to FIGS. 18A to 18D, FIGS.19A to 19D, FIGS. 20A to 20C, and FIGS. 21A to 21F. Specifically, thestructure of an electrode that can be used as the first electrode C1(i)or the second electrode C2(j) will be described.

FIG. 18A is a schematic top view of a sensor panel 1010. The sensorpanel 1010 includes a plurality of electrodes 1031, a plurality ofelectrodes 1032, a plurality of wirings 1041, and a plurality of wirings1042 over a substrate 1030. The substrate 1030 is provided with aflexible printed circuit (FPC) 1050 which is electrically connected toeach of the plurality of wirings 1041 and the plurality of wirings 1042.FIG. 18A illustrates an example in which the FPC 1050 is provided withan IC 1051.

FIG. 18B shows an enlarged view of a region surrounded by a dasheddotted line in FIG. 18A. The electrodes 1031 are in the form of a seriesof rhombic electrode patterns aligned in a lateral direction in thisfigure. The rhombic electrode patterns aligned in a line areelectrically connected to each other. The electrodes 1032 are also inthe form of a series of rhombic electrode patterns aligned in alongitudinal direction in this figure and the rhombic electrode patternsaligned in a line are electrically connected to each other. Park of theelectrode 1031 and part of the electrode 1032 overlap and intersect witheach other. At this intersection portion, an insulator is sandwiched inorder to avoid an electrical short-circuit between the electrode 1031and the electrode 1032.

As shown in FIG. 18C, the electrodes 1032 may include a plurality ofrhombic electrodes 1033 and bridge electrodes 1034. The electrodes 1033are aligned in a longitudinal direction in this figure, and two adjacentelectrodes 1033 are electrically connected to each other by the bridgeelectrode 1034. Such a structure allows the electrodes 1033 and theelectrodes 1031 to be formed at the same time by processing the sameconductive film. This can prevent variations in the thickness of thesefilms, and can prevent the resistance value and the light transmittanceof each electrode from varying from place to place. Note that althoughthe electrodes 1032 include the bridge electrodes 1034 here, theelectrodes 1031 may have such a structure.

As shown in FIG. 18D, a design in which rhombic electrode patterns ofthe electrodes 1031 and 1032 shown in FIG. 18B are hollowed out and onlyedge portions are left may be used. At that time, when the electrodes1031 and the electrodes 1032 are too small in width for the users tosee, the electrodes 1031 and the electrodes 1032 can be formed using alight-blocking material such as a metal or an alloy, as described later.In addition, either the electrodes 1031 or the electrodes 1032 shown inFIG. 18D may include the above bridge electrodes 1034.

One of the electrodes 1031 is electrically connected to one of thewirings 1041. One of the electrodes 1032 is electrically connected toone of the wirings 1042. Here, either one of the electrode 1031 and theelectrode 1032 corresponds to a row wiring, and the other corresponds toa column wiring.

A signal output from the IC 1051 is supplied to either of the electrodes1031 and the electrodes 1032 through the wirings 1041 or the wirings1042. Current (or a potential) flowing through either of the electrodes1031 and the electrodes 1032 is input to the IC 1051 through the wirings1041 or the wirings 1042.

When a touch panel is formed in such a manner that the sensor panel 1010is stacked over a display surface of the display panel, alight-transmitting conductive material is preferably used for theelectrodes 1031 and the electrodes 1032. In the case where alight-transmitting conductive material is used for the electrodes 1031and the electrodes 1032 and light from the display panel is extractedthrough the electrodes 1031 or the electrodes 1032, it is preferablethat a conductive film containing the same conductive material bearranged between the electrodes 1031 and the electrodes 1032 as a dummypattern. When part of a space between the electrodes 1031 and theelectrodes 1032 is filled with the dummy pattern in this manner,variation in light transmittance can be reduced. As a result, unevennessin luminance of light transmitted through the sensor panel 1010 can bereduced.

As a light-transmitting conductive material, a conductive oxide such asindium oxide, indium tin oxide, indium zinc oxide, zinc oxide, or zincoxide to which gallium is added can be used. Note that a film includinggraphene may be used as well. The film including graphene can be formed,for example, by reducing a film containing graphene oxide. As a reducingmethod, a method with application of heat or the like can be employed.

Further, a metal film or an alloy film which is thin enough to have alight-transmitting property can be used. For example, a metal materialsuch as gold, silver, platinum, magnesium, nickel, tungsten, chromium,molybdenum, iron, cobalt, copper, palladium, or titanium, or an alloymaterial containing any of these metal materials can be used.Alternatively, a nitride of the metal material or the alloy material(e.g., titanium nitride), or the like may be used. Alternatively, astacked film in which two or more of conductive films containing theabove materials are stacked may be used.

For the electrodes 1031 and the electrodes 1032, a conductive film thatis processed to be thin enough to be invisible to the users may be used.Such a conductive film is processed into a lattice shape (a mesh shape),for example, which makes it possible to achieve both high conductivityand better viewability of the display device. It is preferable that theconductive film have a portion in which the width is greater than orequal to 30 nm and less than or equal to 100 μm, preferably greater thanor equal to 50 nm and less than or equal to 50 μm, and furtherpreferably greater than or equal to 50 nm and less than or equal to 20μm. In particular, the conductive film having the pattern width of 10 μmor less is extremely difficult to be seen by the users, which ispreferable.

As examples, enlarged schematic views of part of the electrodes 1031 orthe electrodes 1032 are shown in FIGS. 19A to 19D. FIG. 19A shows anexample in which a lattice-shape conductive film 1061 is used. Theconductive film 1061 is preferably placed so as not to overlap with thedisplay element included in the display device because light from thedisplay device is not blocked. In that case, it is preferable that thedirection of the lattice be the same as the direction of the displayelement arrangement and that the pitch of the lattice be an integermultiple of the pitch of the display element arrangement.

FIG. 19B shows an example of a lattice-shape conductive film 1062, whichis processed so as to be provided with triangle openings. Such astructure makes it possible to further reduce the resistance comparedwith the structure shown in FIG. 19A.

In addition, a conductive film 1063, which has an irregular patternshape, may be used as shown in FIG. 19C. Such a structure can preventgeneration of moire when overlapping with the display portion of thedisplay device.

Conductive nanowires may be used for the electrodes 1031 and theelectrodes 1032. FIG. 19D shows an example in which nanowires 1064 areused. The nanowires 1064 are dispersed at appropriate density so thatadjacent nanowires are in contact with each other, which can form atwo-dimensional network; therefore, a conductive film with extremelyhigh light-transmitting property can be provided. For example, ananowire which has a mean value of the diameters of greater than orequal to 1 nm and less than or equal to 100 nm, preferably greater thanor equal to 5 nm and less than or equal to 50 nm, further preferablygreater than or equal to 5 nm and less than or equal to 25 nm can beused. As the nanowire 1064, a metal nanowire such as an Ag nanowire, aCu nanowire, and an Al nanowire, a carbon nanotube, or the like can beused. When using an Ag nanowire, for example, light transmittance ofgreater than or equal to 89% and a sheet resistance of greater than orequal to 40 ohm/square and less than or equal to 100 ohm/square can beachieved.

Although examples in which a plurality of rhombuses are aligned in onedirection are shown in FIG. 18A and the like as top surface shapes ofthe electrodes 1031 and the electrodes 1032, the shapes of theelectrodes 1031 and the electrodes 1032 are not limited thereto and canhave various top surface shapes such as a belt shape (a rectangularshape), a belt shape having a curve, and a zigzag shape. In addition,although the above shows the electrodes 1031 and the electrodes 1032that are arranged to be perpendicular to each other, they are notnecessarily arranged to be perpendicular and the angle formed by two ofthe electrodes may be less than 90°.

FIGS. 20A to 20C illustrate examples in which electrodes 1036 andelectrodes 1037, which have a top surface shape of thin lines, are usedinstead of the electrodes 1031 and the electrodes 1032. FIG. 20A showsan example in which linear electrodes 1036 and 1037 are arranged to forma lattice shape.

FIG. 20B shows an example in which the electrodes 1036 and theelectrodes 1037 have a top surface shape of a zigzag shape. As shown inFIG. 20B, the electrodes 1036 and the electrodes 1037 are arranged so asnot to cross the straight-line portions at the centers but so as toplace the centers of the straight-line portions in different positionsfrom each other; therefore, the length of closely facing parallel partsof the electrodes 1036 and the electrodes 1037 can be longer, mutualcapacitance between the electrodes is increased, and the detectionsensitivity is improved, which is preferable. Alternatively, as shown inFIG. 20C, the electrodes 1036 and the electrodes 1037 are arranged so asto have a design in which part of the straight-line portion of a zigzagshape is projected, which can increase the mutual capacitance betweenthe electrodes because the length of the parts facing each other can belonger even when the centers of the straight-line portions are placed inthe same position.

FIGS. 21A to 21C show enlarged views of a region surrounded by a dasheddotted line in FIG. 20B, and FIGS. 21D to 21F show enlarged views of aregion surrounded by a dashed dotted line in FIG. 20C. In thesedrawings, the electrodes 1036, the electrodes 1037, and intersectionportions 1038 at which the electrodes 1036 and the electrodes 1037intersect are illustrated. The straight-line portions of the electrodes1036 and the electrodes 1037 shown in FIGS. 21A and 21D may have aserpentine shape that meanders with angled corners as shown in FIGS. 21Band 21E or may have a serpentine shape that continuously meanders asshown in FIGS. 21C and 21F.

Structural Example 7 of Input/Output Device

A structure that can be used for the sensor panel 600 of theinput/output device 500TP of one embodiment of the present inventionwill be described with reference to FIGS. 22A and 22B and FIGS. 23A and23B. Specifically, the structure of an in-cell touch panel in whichliquid crystal elements instead of light-emitting elements are used asdisplay elements will be described.

FIG. 22A is an equivalent circuit diagram of part of a pixel circuitprovided in the display portion of the touch panel described in thisstructural example.

Each pixel includes at least a transistor 2503 and a liquid crystalelement 2504. In addition, a gate of the transistor 2503 is electricallyconnected to a wiring 2501 and one of a source and a drain of thetransistor 2503 is electrically connected to a wiring 2502.

The pixel circuit includes a plurality of wirings extending in the Xdirection (e.g., a wiring 2510_1 and a wiring 2510_2) and a plurality ofwirings extending in the Y direction (e.g., wirings 2511). These wiringsare provided to intersect with each other, and capacitance is formedtherebetween.

Among the pixels provided in the pixel circuit, ones of electrodes ofthe liquid crystal elements of some pixels adjacent to each other areelectrically connected to each other to form one block. The block isclassified into two types: an island-shaped block (e.g., a block 2515_1or a block 2515_2) and a linear block (e.g., a block 2516) extending inthe Y direction. Note that only part of the pixel circuit is illustratedin FIGS. 22A and 22B, and actually, these two kinds of blocks arerepeatedly arranged in the X direction and the Y direction.

The wiring 2510_1 (or 2510_2) extending in the X direction iselectrically connected to the island-shaped block 2515_1 (or the block2515_2). Although not illustrated, the wiring 2510_1 extending in the Xdirection is electrically connected to a plurality of island-shapedblocks 2515_1 which are provided discontinuously along the X directionwith the linear blocks therebetween. Further, the wiring 2511 extendingin the Y direction is electrically connected to the linear block 2516.

FIG. 22B is an equivalent circuit diagram illustrating the connectionbetween a plurality of wirings 2510 extending in the X direction and theplurality of wirings 2511 extending in the Y direction. Input voltage ora common potential can be input to each of the wirings 2510 extending inthe X direction. Further, a ground potential can be input to each of thewirings 2511 extending in the Y direction, or the wirings 2511 can beelectrically connected to the detection circuit.

Operation of the above-described touchscreen will be described withreference to FIGS. 23A and 23B.

Here, one frame period is divided into a writing period and a detectingperiod.

The writing period is a period in which image data is written to apixel, and the wirings 2510 (also referred to as gate lines) aresequentially selected. The detecting period is a period in which sensingis performed by a touch sensor, and the wirings 2510 extending in the Xdirection are sequentially selected and input voltage is input.

FIG. 23A is an equivalent circuit diagram in the writing period. In thewriting period, a common potential is input to both the wiring 2510extending in the X direction and the wiring 2511 extending in the Ydirection.

FIG. 23B is an equivalent circuit diagram at some point in time in thedetecting period. In the detecting period, each of the wirings 2511extending in the Y direction is electrically connected to the detectioncircuit. Input voltage is input to the wirings 2510 extending in the Xdirection which are selected, and a common potential is input to thewirings 2510 extending in the X direction which are not selected.

It is preferable that a period in which an image is written and a periodin which sensing is performed by a touch sensor be separately providedas described above. Thus, a decrease in sensitivity of the touch sensorcaused by noise generated when data is written to a pixel can besuppressed.

This embodiment can be combined with any of the other embodiments inthis specification as appropriate.

Embodiment 7

In this embodiment, a structure of a data processor of one embodiment ofthe present invention will be described with reference to FIGS. 16A-1 to16A-3, 16B-1 and 16B-2, and 16C-1 and 16C-2.

FIGS. 16A-1 to 16C-2 illustrate the data processors each of which is oneembodiment of the present invention.

FIGS. 16A-1 to 16A-3 are projection views of a data processor of oneembodiment of the present invention.

FIGS. 16B-1 and 16B-2 are projection views of a data processor of oneembodiment of the present invention.

FIGS. 16C-1 and 16C-2 are a top view and a bottom view of a dataprocessor of one embodiment of the present invention.

<<Data Processor A>>

A data processor 30004 includes an input/output portion 3120 and ahousing 3101 supporting the input/output portion 3120 (see FIGS. 16A-1to 16A-3).

The data processor 3000A further includes an arithmetic unit, a memoryunit that stores a program to be executed by the arithmetic unit, and apower source such as a battery supplying power for driving thearithmetic unit.

Note that the housing 3101 houses the arithmetic unit, the memory unit,the battery, and the like.

The data processor 3000A can display display information on its sidesurface and/or top surface.

A user of the data processor 3000A can supply operation instructions byusing a finger in contact with the side surface and/or the top surface.

<<Data Processor B>>

A data processor 3000B includes an input/output portion 3120 and aninput/output portion 3120 b (see FIGS. 169-1 and 16B-2).

The data processor 3000B further includes a housing 3101 and abelt-shaped flexible housing 3101 b that support the input/outputportion 3120.

The data processor 3000B further includes the housing 3101 supportingthe input/output portion 3120 b.

The data processor 3000B further includes an arithmetic unit, a memoryunit that stores a program to be executed by the arithmetic unit, and apower source such as a battery supplying power for driving thearithmetic unit.

Note that the housing 3101 houses the arithmetic unit, the memory unit,the battery, and the like.

The data processor 3000B can display display information on theinput/output portion 3120 supported by the housing 3101 and thebelt-shaped flexible housing 3101 b.

A user of the data processor 3000B can supply operation instructions byusing a finger in contact with the input/output portion 3120.

<<Data Processor C>>

A data processor 3000C includes an input/output portion 3120 andhousings 3101 and 3101 h supporting the input/output portion 3120 (seeFIGS. 16C-1 and 16C-2).

The input/output portion 3120 and the housing 3101 b have flexibility.

The data processor 3000C further includes an arithmetic unit, a memoryunit that stores a program to be executed by the arithmetic unit, and apower source such as a battery supplying power for driving thearithmetic unit.

Note that the housing 3101 houses the arithmetic unit, the memory unit,the battery, and the like.

The data processor 3000C can be folded in two at a portion of thehousing 3101 b.

This embodiment can be combined with any of the other embodiments inthis specification as appropriate.

Example

In this example, the structures of the functional panels and the devicewhich were fabricated as embodiments of the present invention and thecharacteristics of the functional panels will be described withreference to FIGS. 17A to 17D.

FIGS. 17A to 17D illustrate the structures of the functional panels andthe device which are embodiments of the present invention.

FIG. 17A is a projection view schematically illustrating the structureof a device 200C.

FIG. 17B is a cross-sectional view illustrating the structure of afunctional panel 100(1) that was fabricated.

FIG. 17C is a cross-sectional view illustrating the structure of afunctional panel 100(2) that was fabricated.

FIG. 17D is a cross-sectional view illustrating the structure of afunctional panel 100(3) that was fabricated.

The fabricated functional panels each include a first plane 1, a secondplane 2, a middle plane 5C, a functional layer 3, and a support. Thefunctional panel is fixed to a frame 210C. The frame 210C can put thefunctional panel into a bent state with the first plane 1 inside.

The second plane 2 is opposite the first plane 1, and the middle plane5C is located in the middle of a region between the first plane 1 andthe second plane 2.

The functional layer 3 has a thickness of 20 μm. The functional layer 3was positioned such that a portion thereof having a thickness greaterthan or equal to half of the thickness of the functional layer 3 was ina region between the first plane 1 and the middle plane 5C.

The functional layer 3 includes two functional layers that prevent thediffusion of impurities, a layer including a plurality of pixelsarranged in a matrix, which is between the two functional layers, and abonding layer that bonds the two functional layers together. An epoxyresin was used for the bonding layer.

The pixel includes a coloring layer, a light-emitting element thatoverlaps with the coloring layer, an epoxy resin that attaches thecoloring layer to the light-emitting layer, and a pixel circuit fordriving the light-emitting element. An organic EL element that emitswhite light toward the second plane 2 was used as the light-emittingelement, and the coloring layer was positioned between the second plane2 and the light-emitting element.

The support includes a member 4A, a member 4B, and a member 4E thatattaches the member 4A to the member 4B. A portion of a surface of themember 4A is included in the first plane 1, and a portion of a surfaceof the member 4B is included in the second plane 2. The member 4Esupports the functional layer 3 between the member 4A and the member 4B.Aromatic condensation polymeric films which were shaped by a biaxialstretching method were used as the member 4A and the ember 4B, and anepoxy resin was used for the member 4E.

Each of the fabricated functional panels was repeatedly bent to evaluatethe reliability of the fabricated functional panel. Specifically,bending and unbending of the functional panel with the first plane 1inside was repeated 100,000 times while the curvature radius wascontrolled not to be smaller than or equal to a predetermined value.Then, an image was displayed on the functional panel and the quality ofthe displayed image was evaluated. For example, whether or not a defectsuch as a line defect in the display or a so-called dark spot which is acircular region with low luminance occurs was examined.

In addition, the functional panels which had been bent 100,000 timeswere preserved under a predetermined environment for a predeterminedperiod of time, and the reliability of the functional panels wasevaluated. Specifically, each of the functional panels was preservedunder an environment at 65° C. and 95% RH for 1,000 hours, then, animage was displayed on the functional panel after the preservation, andthe quality of the displayed image was evaluated.

The structures of the fabricated functional panels 100(1) to 100(3), thecurvature radius with which each functional panel was bent in thebending test, and the results of display quality evaluation after thebending test and the preservation test are shown in the table below.Specifically, each of the functional panels 100(1) to 100(3) has astructure in which a portion occupying half or more of the thickness ofthe functional layer 3 is between the middle plane 5C and the firstplane 1.

TABLE 1 Functional panel 100(1) 100(2) 100(3) Thickness/ Member 4A 23 1212 μm Member 4E 5 5 5 Functional 10 10 10 layer 3 Member 4E 5 5 5 Member4B 23 25 50 Total thickness/μm 66 57 82 Distance between first plane tomiddle 33 28.5 41 plane/μm Proportion of portion of functional layer 50%100% 100% between middle plane 5C to first plane 1 to whole offunctional layer Curvature radius with which functional panel 4 mm 2 mm5 mm was bent in 100,000-time bending test Display quality of functionalpanel after Good Good Good bending test and preservation test

Each of the functional panels was able to be repeatedly bent and unbent100,000 times with a favorable curvature radius of 5 mm or less, withouthaving a detect. The display quality after the bending test was good,and the display quality after the preservation test that followed thebending test was also good.

The functional panels that had been subjected to the 100,000-timebending test were preserved under a high-temperature and -humidityenvironment, and then an image was displayed on each of the functionalpanels. The results are shown in the table. Each of the functionalpanels was able to display the image with favorable quality, anddecrease in display quality caused by the preservation was not found.

This example can be combined with any of the embodiments in thisspecification as appropriate.

For example, in this specification and the like, an explicit description“X and Y are connected” means that X and Y are electrically connected, Xand Y are functionally connected, and X and Y are directly connected.Accordingly, another element may be provided between elements having aconnection relation illustrated in drawings and texts, without beinglimited to a predetermined connection relation, for example, theconnection relation illustrated in the drawings and the texts.

Here, X and Y each denote an object (e.g., a device, an element, acircuit, a wiring, an electrode, a terminal, a conductive film, a layer,or the like).

Examples of the case where X and Y are directly connected include thecase where an element that allows an electrical connection between X andY (e.g., a switch, a transistor, a capacitor, an inductor, a resistor, adiode, a display element, a light-emitting element, and a load) is notconnected between X and Y, and the case where X and Y are connectedwithout the element that allows the electrical connection between X andY provided therebetween.

For example, in the case where X and Y are electrically connected, oneor more elements that enable electrical connection between X and Y(e.g., a switch, a transistor, a capacitor, an inductor, a resistor, adiode, a display element, a light-emitting element, or a load) can beconnected between X and Y. A switch is controlled to be on or off. Thatis, a switch is conducting or not conducting (is turned on or oft) todetermine whether current flows therethrough or not. Alternatively, theswitch has a function of selecting and changing a current path. Notethat the case where X and Y are electrically connected includes the casewhere X and Y are directly connected.

For example, in the case where X and Y are functionally connected, oneor more circuits that enable functional connection between X and Y(e.g., a logic circuit such as an inverter, a NAND circuit, or a NORcircuit; a signal converter circuit such as a DA converter circuit, anAD converter circuit, or a gamma correction circuit; a potential levelconverter circuit such as a power supply circuit (e.g., a step-upcircuit, or a step-down circuit) or a level shifter circuit for changingthe potential level of a signal; a voltage source; a current source; aswitching circuit; an amplifier circuit such as a circuit that canincrease signal amplitude, the amount of current, or the like, anoperational amplifier, a differential amplifier circuit, a sourcefollower circuit, or a buffer circuit; a signal generation circuit; amemory circuit; and/or a control circuit) can be connected between X andY. For example, even when another circuit is interposed between X and Y,X and Y are functionally connected if a signal output from X istransmitted to Y. Note that the case where X and Y are functionallyconnected includes the case where X and Y are directly connected and thecase where X and Y are electrically connected.

Note that in this specification and the like, an explicit description “Xand Y are electrically connected” means that X and Y are electricallyconnected (i.e., the case where X and Y are connected with anotherelement or another circuit provided therebetween), X and Y arefunctionally connected (i.e., the case where X and Y are functionallyconnected with another circuit provided therebetween), and X and Y aredirectly connected (i.e., the case where X and Y are connected withoutanother element or another circuit provided therebetween). That is, inthis specification and the like, what is disclosed by the explicitdescription “X and Y are electrically connected” is the same as what isdisclosed by the description “X and Y are connected”.

Note that, for example, the case where a source (or a first terminal orthe like) of a transistor is electrically connected to X through (or notthrough) Z1 and a drain (or a second terminal or the like) of thetransistor is electrically connected to Y through (or not through) Z2,or the case where a source (or a first terminal or the like) of atransistor is directly connected to one part of Z1 and another part ofZ1 is directly connected to X while a drain (or a second terminal or thelike) of the transistor is directly connected to one part of Z2 andanother part of Z2 is directly connected to Y, can be expressed by usingany of the following expressions.

The expressions include, for example, “X, Y, a source (or a firstterminal or the like) of a transistor, and a drain (or a second terminalor the like) of the transistor are electrically connected to each other,and X, the source (or the first terminal or the like) of the transistor,the drain (or the second terminal or the like) of the transistor, and Yare electrically connected to each other in this order”; “a source (or afirst terminal or the like) of a transistor is electrically connected toX, a drain (or a second terminal or the like) of the transistor iselectrically connected to Y, and X, the source (or the first terminal orthe like) of the transistor, the drain (or the second terminal or thelike) of the transistor, and Y are electrically connected to each otherin this order”; and “X is electrically connected to Y through a source(or a first terminal or the like) and a drain (or a second terminal orthe like) of a transistor, and X, the source (or the first terminal orthe like) of the transistor, the drain (or the second terminal or thelike) of the transistor, and Y are provided to be connected in thisorder”. When the connection order in a circuit configuration is definedby an expression similar to the above examples, a source (or a firstterminal or the like) and a drain (or a second terminal or the like) ofa transistor can be distinguished from each other to specify thetechnical scope.

Other examples of the expressions include, “a source (or a firstterminal or the like) of a transistor is electrically connected to Xthrough at least a first connection path, the first connection path doesnot include a second connection path, the second connection path is apath between the source (or the first terminal or the like) of thetransistor and a drain (or a second terminal or the like) of thetransistor, Z1 is on the first connection path, the drain (or the secondterminal or the like) of the transistor is electrically connected to Ythrough at least a third connection path, the third connection path doesnot include the second connection path, and Z2 is on the thirdconnection path”,

“a source (or a first terminal or the like) of a transistor iselectrically connected to X through at least Z1 on a first connectionpath, the first connection path does not include a second connectionpath, the second connection path includes a connection path through thetransistor, a drain (or a second terminal or the like) of the transistoris electrically connected to Y through at least Z2 on a third connectionpath, and the third connection path does not include the secondconnection path”, and “a source (or a first terminal or the like) of atransistor is electrically connected to X through at least Z1 on a firstelectrical path, the first electrical path does not include a secondelectrical path, the second electrical path is an electrical path fromthe source (or the first terminal or the like) of the transistor to adrain (or a second terminal or the like) of the transistor, the drain(or the second terminal or the like) of the transistor is electricallyconnected to Y through at least Z2 on a third electrical path, the thirdelectrical path does not include a fourth electrical path, and thefourth electrical path is an electrical path from the drain (or thesecond terminal or the like) of the transistor to the source (or thefirst terminal or the like) of the transistor”. When the connection pathin a circuit configuration is defined by an expression similar to theabove examples, a source (or a first terminal or the like) and a drain(or a second terminal or the like) of a transistor can be distinguishedfrom each other to specify the technical scope.

Note that these expressions are examples and there is no limitation onthe expressions. Here, X, Y, Z1, and Z2 each denote an object (e.g., adevice, an element, a circuit, a wiring, an electrode, a terminal, aconductive film, and a layer).

Even when independent components are electrically connected to eachother in a circuit diagram, one component has functions of a pluralityof components in some cases. For example, when part of a wiring alsofunctions as an electrode, one conductive film functions as the wiringand the electrode. Thus, “electrical connection” in this specificationincludes in its category such a case where one conductive film hasfunctions of a plurality of components.

This application is based on Japanese Patent Application serial no.2014-208884 filed with Japan Patent Office on Oct. 10, 2014, the entirecontents of which are hereby incorporated by reference.

What is claimed is:
 1. A panel comprising: a first member and a secondmember; and a third member and a functional layer between the firstmember and the second member, wherein a middle plane is located in thethird member, wherein the middle plane is at a half distance from a topsurface of the first member to a lower surface of the second member, andwherein the functional layer is in contact with the first member.
 2. Thepanel according to claim 1, wherein the functional layer includes atleast one of a display element and a sensor element.
 3. The panelaccording to claim 1, wherein the third member is thicker than the firstmember and the second member.
 4. The panel according to claim 1, whereineach of the first member and the second member is a polymeric film. 5.The panel according to claim 1, wherein the third member is an epoxyresin.
 6. A panel comprising: a first member and a second member; and athird member and a functional layer between the first member and thesecond member, wherein a middle plane is located in the third member,wherein the middle plane is at a half distance from a top surface of thefirst member to a lower surface of the second member, wherein thefunctional layer is in contact with the first member, and wherein aterminal provided on the functional layer overlaps an opening providedin the first member.
 7. The panel according to claim 6, wherein thefunctional layer includes at least one of a display element and a sensorelement.
 8. The panel according to claim 6, wherein the third member isthicker than the first member and the second member.
 9. The panelaccording to claim 6, wherein each of the first member and the secondmember is a polymeric film.
 10. The panel according to claim 6, whereinthe third member is an epoxy resin.